Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-113-02-F-D-430

ESQT-113-02-F-D-430

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,631 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.430 (10.92mm) 0.420 (10.67mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-433

ESQT-113-02-F-D-433

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.433 (11.00mm) 0.417 (10.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-455

ESQT-113-02-F-D-455

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,267 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.455 (11.56mm) 0.395 (10.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-490

ESQT-113-02-F-D-490

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,838 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.490 (12.44mm) 0.360 (9.14mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-500

ESQT-113-02-F-D-500

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,390 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-509

ESQT-113-02-F-D-509

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,437 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.509 (12.93mm) 0.341 (8.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-510

ESQT-113-02-F-D-510

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.510 (12.95mm) 0.340 (8.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-512

ESQT-113-02-F-D-512

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,767 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.512 (13.00mm) 0.338 (8.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-520

ESQT-113-02-F-D-520

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,788 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.520 (13.20mm) 0.330 (8.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-550

ESQT-113-02-F-D-550

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,640 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-590

ESQT-113-02-F-D-590

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,837 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.590 (14.99mm) 0.260 (6.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-600

ESQT-113-02-F-D-600

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,263 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-615

ESQT-113-02-F-D-615

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,803 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.615 (15.62mm) 0.235 (5.97mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-625

ESQT-113-02-F-D-625

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,227 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.625 (15.88mm) 0.225 (5.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-650

ESQT-113-02-F-D-650

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,724 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-677

ESQT-113-02-F-D-677

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,942 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.677 (17.20mm) 0.173 (4.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-680

ESQT-113-02-F-D-680

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,537 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-710

ESQT-113-02-F-D-710

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,857 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-725

ESQT-113-02-F-D-725

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,675 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.725 (18.42mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-750

ESQT-113-02-F-D-750

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,803 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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