Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLP-113-02-LM-D-A-P

CLP-113-02-LM-D-A-P

CONN RCPT 26POS 0.05 GOLD SMD

Samtec Inc.
3,238 -

RFQ

Tube CLP Active Receptacle Female Socket Board to Board 26 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SL-128-T-12

SL-128-T-12

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc.
2,147 -

RFQ

SL-128-T-12

Ficha técnica

Bulk SL Active Receptacle Female Socket Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.095 (2.41mm) 0.095 (2.41mm) -55°C ~ 125°C - - - -
MMS-135-01-T-SV

MMS-135-01-T-SV

CONN RCPT 35POS 0.079 TIN PCB

Samtec Inc.
2,354 -

RFQ

MMS-135-01-T-SV

Ficha técnica

Bulk MMS Active Receptacle Female Socket Board to Board or Cable 35 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.175 (4.45mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin - -
MMS-122-02-L-SV

MMS-122-02-L-SV

CONN RCPT 22POS 0.079 GOLD SMD

Samtec Inc.
3,327 -

RFQ

MMS-122-02-L-SV

Ficha técnica

Tube MMS Active Receptacle Female Socket Board to Board or Cable 22 All 0.079 (2.00mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Tin - -
SQT-131-01-L-S

SQT-131-01-L-S

CONN RCPT 31POS 0.079 GOLD PCB

Samtec Inc.
3,576 -

RFQ

SQT-131-01-L-S

Ficha técnica

Bulk SQT Active Receptacle Forked Board to Board or Cable 31 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250 (6.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-110-01-SM-D

CLT-110-01-SM-D

CONN RCPT 20POS 0.079 GOLD PCB

Samtec Inc.
2,749 -

RFQ

Bulk CLT Active Receptacle Female Socket Board to Board 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) 0.085 (2.16mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-116-34-T-D

ESQ-116-34-T-D

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.
2,060 -

RFQ

ESQ-116-34-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-126-44-T-S

ESQ-126-44-T-S

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc.
2,054 -

RFQ

ESQ-126-44-T-S

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-105-02-F-Q-309

ESQT-105-02-F-Q-309

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc.
2,088 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-S-D-309

ESQT-106-02-S-D-309

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
2,277 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-309

ESQT-113-02-F-D-309

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,121 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-310

ESQT-113-02-F-D-310

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,776 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-400

ESQT-113-02-F-D-400

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,518 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.400 (10.16mm) 0.450 (11.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-720

ESQT-113-02-F-D-720

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,261 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-740

ESQT-113-02-F-D-740

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,750 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-770

ESQT-113-02-F-D-770

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,969 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.770 (19.56mm) 0.080 (2.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-790

ESQT-113-02-F-D-790

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,594 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.790 (20.07mm) 0.060 (1.52mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-F-Q-310

ESQT-105-02-F-Q-310

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc.
3,061 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-F-Q-800

ESQT-105-02-F-Q-800

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc.
3,525 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.800 (20.32mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-S-D-500

ESQT-106-02-S-D-500

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
2,441 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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