Acerca de nosotros
Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
Idioma
Subir BOM
Cart
Todas las categorías

Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-110-02-L-D-550

ESQT-110-02-L-D-550

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,206 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-551

ESQT-110-02-L-D-551

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,284 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.551 (14.00mm) 0.299 (7.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-575

ESQT-110-02-L-D-575

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,799 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.575 (14.60mm) 0.275 (6.99mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-576

ESQT-110-02-L-D-576

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,145 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.576 (14.63mm) 0.274 (6.96mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-590

ESQT-110-02-L-D-590

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,325 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.590 (14.99mm) 0.260 (6.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-591

ESQT-110-02-L-D-591

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,193 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.591 (15.00mm) 0.259 (6.58mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-594

ESQT-110-02-L-D-594

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,990 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.594 (15.09mm) 0.256 (6.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-595

ESQT-110-02-L-D-595

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,369 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.595 (15.11mm) 0.255 (6.48mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-598

ESQT-110-02-L-D-598

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,875 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.598 (15.19mm) 0.252 (6.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-600

ESQT-110-02-L-D-600

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,267 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-604

ESQT-110-02-L-D-604

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,711 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.604 (15.35mm) 0.246 (6.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-610

ESQT-110-02-L-D-610

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,754 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.610 (15.49mm) 0.240 (6.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-620

ESQT-110-02-L-D-620

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,638 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.620 (15.75mm) 0.230 (5.84mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-625

ESQT-110-02-L-D-625

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,926 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.625 (15.88mm) 0.225 (5.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-630

ESQT-110-02-L-D-630

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,718 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.630 (16.00mm) 0.220 (5.58mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-650

ESQT-110-02-L-D-650

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,810 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-655

ESQT-110-02-L-D-655

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,897 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.655 (16.63mm) 0.195 (4.95mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-665

ESQT-110-02-L-D-665

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,057 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.665 (16.90mm) 0.185 (4.70mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-680

ESQT-110-02-L-D-680

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,591 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-685

ESQT-110-02-L-D-685

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,785 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.685 (17.40mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
Total 38494 Record«Prev1... 18541855185618571858185918601861...1925Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario