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Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SSM-113-SM-DV-LC-TR

SSM-113-SM-DV-LC-TR

CONN RCPT 26POS 0.1 GOLD SMD

Samtec Inc. 		2,857 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
MMS-111-02-S-DV-A-M-TR

MMS-111-02-S-DV-A-M-TR

CONN RCPT 22POS 0.079 GOLD SMD

Samtec Inc. 		3,012 -

RFQ

Tape & Reel (TR) MMS Active Receptacle Female Socket Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Tin - -
SSM-116-S-DV-BE-A-P-TR

SSM-116-S-DV-BE-A-P-TR

CONN RCPT 32POS 0.1 GOLD SMD

Samtec Inc. 		2,486 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-116-S-DV-BE-LC-P-TR

SSM-116-S-DV-BE-LC-P-TR

CONN RCPT 32POS 0.1 GOLD SMD

Samtec Inc. 		3,394 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-116-S-DV-LC-P-TR

SSM-116-S-DV-LC-P-TR

CONN RCPT 32POS 0.1 GOLD SMD

Samtec Inc. 		3,514 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CLT-130-02-L-D-BE-A-K-TR

CLT-130-02-L-D-BE-A-K-TR

CONN RCPT 60POS 0.079 GOLD SMD

Samtec Inc. 		3,817 -

RFQ

CLT-130-02-L-D-BE-A-K-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 60 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
BCS-132-F-S-TE

BCS-132-F-S-TE

CONN RCPT 32POS 0.1 GOLD PCB

Samtec Inc. 		2,037 -

RFQ

BCS-132-F-S-TE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 32 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290 (7.37mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-150-T-S-PE

BCS-150-T-S-PE

CONN RCPT 50POS 0.1 TIN PCB

Samtec Inc. 		2,490 -

RFQ

BCS-150-T-S-PE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-150-T-S-TE

BCS-150-T-S-TE

CONN RCPT 50POS 0.1 TIN PCB

Samtec Inc. 		2,342 -

RFQ

BCS-150-T-S-TE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.290 (7.37mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-130-24-T-S

ESW-130-24-T-S

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc. 		2,756 -

RFQ

ESW-130-24-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
SMM-105-02-S-D-LC

SMM-105-02-S-D-LC

CONN RCPT 10POS 0.079 GOLD SMD

Samtec Inc. 		2,144 -

RFQ

SMM-105-02-S-D-LC

Ficha técnica

 Tube Tiger Eye™ SMM Active Receptacle Female Socket Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.140 (3.56mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-670

ESQT-110-02-L-D-670

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,783 -

RFQ

ESQT-110-02-L-D-670

Ficha técnica

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.670 (17.02mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-117-24-S-S

BSW-117-24-S-S

CONN RCPT 17POS 0.1 GOLD PCB

Samtec Inc. 		2,137 -

RFQ

BSW-117-24-S-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-121-04-T-D

BSW-121-04-T-D

CONN RCPT 42POS 0.1 TIN PCB

Samtec Inc. 		3,334 -

RFQ

BSW-121-04-T-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Tin - Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-136-14-T-S

ESQ-136-14-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc. 		2,260 -

RFQ

ESQ-136-14-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-110-02-L-D-309

ESQT-110-02-L-D-309

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,299 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-368

ESQT-110-02-L-D-368

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,715 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.368 (9.35mm) 0.482 (12.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-374

ESQT-110-02-L-D-374

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,679 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.374 (9.50mm) 0.476 (12.09mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-410

ESQT-110-02-L-D-410

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,251 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.410 (10.41mm) 0.440 (11.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-L-D-430

ESQT-110-02-L-D-430

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,215 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.430 (10.92mm) 0.420 (10.67mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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