Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
416-87-250-41-011101

416-87-250-41-011101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip
2,523 -

RFQ

416-87-250-41-011101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.709 (18.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
833-87-066-10-273101

833-87-066-10-273101

CONN SOCKET 66POS 0.079 GOLD PCB

Preci-Dip
2,601 -

RFQ

833-87-066-10-273101

Ficha técnica

Bulk 833 Active Socket Female Socket Board to Board 66 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.110 (2.79mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
67117-132

67117-132

CONN RCPT 64POS 0.1 GOLD PCB R/A

Amphenol ICC (FCI)
3,434 -

RFQ

67117-132

Ficha técnica

Bag Dubox™ Active Receptacle Female Socket Board to Board 64 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.240 (6.10mm) 0.115 (2.92mm) - - Gold - -
CLP-150-02-G-D-BE-PA

CLP-150-02-G-D-BE-PA

CONN RCPT 100POS 0.05 GOLD SMD

Samtec Inc.
3,370 -

RFQ

CLP-150-02-G-D-BE-PA

Ficha técnica

Tray CLP Active Receptacle, Bottom Entry Female Socket Board to Board 100 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
833-87-048-30-001101

833-87-048-30-001101

CONN SOCKET 48POS 0.079 GOLD SMD

Preci-Dip
2,548 -

RFQ

833-87-048-30-001101

Ficha técnica

Bulk 833 Active Socket Female Socket Board to Board 48 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold Flash Black 0.228 (5.80mm) - -55°C ~ 125°C UL94 V-0 Tin - -
316-83-136-41-004101

316-83-136-41-004101

CONN SOCKET 36POS 0.1 GOLD PCB

Preci-Dip
2,628 -

RFQ

316-83-136-41-004101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.866 (22.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-83-236-41-004101

416-83-236-41-004101

CONN SOCKET 36POS 0.1 GOLD PCB

Preci-Dip
3,498 -

RFQ

416-83-236-41-004101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.866 (22.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-132-23-T-S

ESQ-132-23-T-S

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.
3,606 -

RFQ

ESQ-132-23-T-S

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-136-44-T-S

ESW-136-44-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.
3,537 -

RFQ

ESW-136-44-T-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
SLW-147-01-G-S

SLW-147-01-G-S

CONN RCPT 47POS 0.1 GOLD PCB

Samtec Inc.
2,865 -

RFQ

SLW-147-01-G-S

Ficha técnica

Bulk SLW Active Receptacle Forked Board to Board 47 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 125°C - Gold 6.09mm -
SSQ-122-02-S-D

SSQ-122-02-S-D

CONN RCPT 44POS 0.1 GOLD PCB

Samtec Inc.
3,715 -

RFQ

SSQ-122-02-S-D

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-43-134-41-007000

316-43-134-41-007000

CONN SOCKET 34POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,980 -

RFQ

316-43-134-41-007000

Ficha técnica

Bulk 316 Active Elevated Socket Female Socket Board to Board 34 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.402 (10.20mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-93-140-41-006000

316-93-140-41-006000

CONN SOCKET 40POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,754 -

RFQ

316-93-140-41-006000

Ficha técnica

Bulk 316 Active Elevated Socket Female Socket Board to Board 40 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.236 (6.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - -
BSW-112-04-G-D

BSW-112-04-G-D

CONN RCPT 24POS 0.1 GOLD PCB

Samtec Inc.
3,832 -

RFQ

BSW-112-04-G-D

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-24-T-D

ESQ-117-24-T-D

CONN SOCKET 34POS 0.1 TIN PCB

Samtec Inc.
2,897 -

RFQ

ESQ-117-24-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-123-03-F-S-400

ESQT-123-03-F-S-400

CONN SOCKET 23POS 0.079 GOLD PCB

Samtec Inc.
2,990 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 23 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.400 (10.16mm) 0.058 (1.47mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-105-S-DH-LC

SSM-105-S-DH-LC

CONN RCPT 10POS 0.1 GOLD SMD R/A

Samtec Inc.
2,256 -

RFQ

Tube SSM Active Receptacle Female Socket Board to Board or Cable 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
SSM-120-F-DV-BE

SSM-120-F-DV-BE

CONN RCPT 40POS 0.1 GOLD SMD

Samtec Inc.
2,313 -

RFQ

Tube SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSW-114-03-S-D

SSW-114-03-S-D

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc.
2,796 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 28 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-121-01-G-P

SSW-121-01-G-P

CONN RCPT 21POS 0.1 GOLD PCB

Samtec Inc.
3,040 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 21 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario