Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLP-137-02-L-D-A-P-TR

CLP-137-02-L-D-A-P-TR

CONN RCPT 74POS 0.05 GOLD SMD

Samtec Inc.
3,475 -

RFQ

CLP-137-02-L-D-A-P-TR

Ficha técnica

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 74 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
831-87-046-30-001101

831-87-046-30-001101

CONN SOCKET 46POS 0.079 GOLD SMD

Preci-Dip
2,897 -

RFQ

831-87-046-30-001101

Ficha técnica

Bulk 831 Active Socket Female Socket Board to Board 46 All 0.079 (2.00mm) 1 - Surface Mount Solder Push-Pull Gold Flash Black 0.228 (5.80mm) - -55°C ~ 125°C UL94 V-0 Tin - -
316-83-150-41-008101

316-83-150-41-008101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip
2,060 -

RFQ

316-83-150-41-008101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.472 (12.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-83-250-41-008101

416-83-250-41-008101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip
3,610 -

RFQ

416-83-250-41-008101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.472 (12.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
0901512240

0901512240

CONN RCPT 40POS 0.1 GOLD PCB

Molex
3,870 -

RFQ

0901512240

Ficha técnica

Tube C-Grid III 90151 Active Receptacle Female Socket Board to Board 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 15.0µin (0.38µm) Black 0.335 (8.51mm) 0.114 (2.90mm) -55°C ~ 105°C - Tin - -
801-87-017-10-216101

801-87-017-10-216101

CONN SOCKET 17POS 0.1 GOLD PCB

Preci-Dip
2,521 -

RFQ

801-87-017-10-216101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 1.476 (37.50mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-130-34-T-S

ESW-130-34-T-S

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc.
2,996 -

RFQ

ESW-130-34-T-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-120-23-T-D-LL

ESW-120-23-T-D-LL

CONN SOCKET 40POS 0.1 TIN PCB

Samtec Inc.
3,415 -

RFQ

ESW-120-23-T-D-LL

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
BCS-138-L-S-HE

BCS-138-L-S-HE

CONN RCPT 38POS 0.1 GOLD PCB R/A

Samtec Inc.
2,088 -

RFQ

BCS-138-L-S-HE

Ficha técnica

Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 38 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSA-126-W-G

SSA-126-W-G

CONN RCPT 26POS 0.1 GOLD PCB

Samtec Inc.
2,195 -

RFQ

SSA-126-W-G

Ficha técnica

Bulk SSA Active Receptacle, Breakaway Female Socket Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 10.0µin (0.25µm) Black 0.230 (5.85mm) 0.656 (16.66mm) -55°C ~ 125°C UL94 V-0 - - -
SSW-140-02-G-S-RA

SSW-140-02-G-S-RA

CONN RCPT 40POS 0.1 GOLD PCB R/A

Samtec Inc.
2,711 -

RFQ

SSW-140-02-G-S-RA

Ficha técnica

Bulk SSW Active Receptacle Forked Board to Board or Cable 40 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.095 (2.41mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Gold - -
311-43-150-41-001000

311-43-150-41-001000

CONN RCPT 50POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,969 -

RFQ

311-43-150-41-001000

Ficha técnica

Bulk 311 Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-43-155-41-001000

315-43-155-41-001000

CONN RCPT 55POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,711 -

RFQ

315-43-155-41-001000

Ficha técnica

Bulk 315 Active Receptacle Female Socket Board to Board 55 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-122-T-D-HE

BCS-122-T-D-HE

CONN RCPT 44POS 0.1 TIN PCB R/A

Samtec Inc.
2,650 -

RFQ

BCS-122-T-D-HE

Ficha técnica

Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.210 (5.33mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-122-TM-D-HE

BCS-122-TM-D-HE

CONN RCPT 44POS 0.1 TIN PCB R/A

Samtec Inc.
3,117 -

RFQ

BCS-122-TM-D-HE

Ficha técnica

Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.210 (5.33mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-108-02-S-D-A-P

CLT-108-02-S-D-A-P

CONN RCPT 16POS 0.079 GOLD SMD

Samtec Inc.
3,634 -

RFQ

CLT-108-02-S-D-A-P

Ficha técnica

Tube CLT Active Receptacle Female Socket Board to Board 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-136-24-T-S

ESQ-136-24-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.
2,820 -

RFQ

ESQ-136-24-T-S

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-03-L-Q-350

ESQT-103-03-L-Q-350

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
3,196 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-113-T-24

ESS-113-T-24

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.
3,521 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 13 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-118-33-G-S

ESW-118-33-G-S

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.
2,017 -

RFQ

ESW-118-33-G-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario