Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
72307-168HT

72307-168HT

CONN HDR 68POS 0.100 STACK TH

Amphenol ICC (FCI)
2,936 -

RFQ

72307-168HT

Ficha técnica

Tube BERGSTIK®, MezzSelect™, Basics+ Active 68 0.100 (2.54mm) 2 0.100 (2.54mm) 0.880 (22.352mm) 0.330 (8.382mm) 0.300 (7.620mm) 0.250 (6.350mm) Through Hole Solder Gold 30.0µin (0.76µm)
76745-109-72LF

76745-109-72LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,303 -

RFQ

76745-109-72LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.525 (13.335mm) 0.225 (5.715mm) 0.200 (5.080mm) 0.100 (2.540mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-G40-25-120

59112-G40-25-120

CONN HDR STACK

Amphenol ICC (FCI)
2,485 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-117-40LF

76745-117-40LF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,991 -

RFQ

76745-117-40LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.339 (34.000mm) 0.295 (7.500mm) 0.923 (23.450mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
76745-1CD-40LF

76745-1CD-40LF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,499 -

RFQ

76745-1CD-40LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.200 (30.480mm) 0.364 (9.246mm) 0.472 (12.000mm) 0.364 (9.246mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59132-G36-20-060LF

59132-G36-20-060LF

CONN HDR STACK

Amphenol ICC (FCI)
2,230 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-101-44LF

76745-101-44LF

CONN HDR 44POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,875 -

RFQ

76745-101-44LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 44 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.343 (8.712mm) 0.778 (19.761mm) 0.104 (2.650mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
76745-136-48LF

76745-136-48LF

CONN HDR 48POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,604 -

RFQ

76745-136-48LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 48 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.415 (10.541mm) 0.295 (7.500mm) 0.415 (10.550mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
76745-507-72LF

76745-507-72LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,173 -

RFQ

76745-507-72LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.725 (18.415mm) 0.220 (5.588mm) 0.406 (10.300mm) 0.100 (2.540mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-819601300LF

54122-819601300LF

CONN HDR 60POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,054 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 60 0.100 (2.54mm) 2 0.100 (2.54mm) 0.882 (22.400mm) 0.250 (6.350mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-112402000LF

54112-112402000LF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,096 -

RFQ

54112-112402000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.443 (11.252mm) 0.787 (20.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
63444-001TC

63444-001TC

CONN HDR 50POS 0.079 STACK SMD

Amphenol ICC (FCI)
2,718 -

RFQ

Tube Minitek® MezzSelect™, Basics+ Active 50 0.079 (2.00mm) 2 0.079 (2.00mm) - 0.161 (4.100mm) 0.481 (12.217mm) - Surface Mount Solder Gold, GXT™ 30.0µin (0.76µm)
10065491-006TRLF

10065491-006TRLF

CONN HDR 30P 0.079 STACK SMD

Amphenol ICC (FCI)
2,071 -

RFQ

Tape & Reel (TR) Minitek® Active 30 0.079 (2.00mm) 2 0.079 (2.00mm) - 0.138 (3.500mm) - - Surface Mount Solder Gold 30.0µin (0.76µm)
76745-8DB-40LF

76745-8DB-40LF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,040 -

RFQ

76745-8DB-40LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.339 (34.000mm) 0.502 (12.751mm) 0.335 (8.500mm) 0.502 (12.751mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
10065491-003TRLF

10065491-003TRLF

CONN HDR 48P 0.079 STACK SMD

Amphenol ICC (FCI)
2,112 -

RFQ

Tape & Reel (TR) Minitek® Active 48 0.079 (2.00mm) 2 0.079 (2.00mm) - 0.136 (3.454mm) - - Surface Mount Solder Gold 30.0µin (0.76µm)
59112-G40-25-166LF

59112-G40-25-166LF

CONN HDR STACK

Amphenol ICC (FCI)
3,034 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-106721000LF

54122-106721000LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,215 -

RFQ

54122-106721000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.230 (5.842mm) 0.394 (10.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-G40-16-159LF

59112-G40-16-159LF

CONN HDR STACK

Amphenol ICC (FCI)
2,877 -

RFQ

Bag * Active - - - - - - - - - - - -
59132-G32-25U070LF

59132-G32-25U070LF

CONN HDR STACK

Amphenol ICC (FCI)
3,668 -

RFQ

Tube * Active - - - - - - - - - - - -
75970-587-08LF

75970-587-08LF

CONN HDR 8POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,414 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 8 0.100 (2.54mm) 1 - - - - - Through Hole Solder Gold Flash
Total 1780 Record«Prev1... 83848586878889Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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