Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
87690-109RLF CONN HDR 0.100 STACK T/H GOLD Amphenol ICC (FCI)	2,860	-	RFQ		Bag	BERGSTIK® II, MezzSelect™, Basics+	Active	-	0.100 (2.54mm)	2	0.100 (2.54mm)	-	-	-	-	Through Hole	Kinked Pin, Solder	Gold, GXT™	30.0µin (0.76µm)
54122-111721650LF CONN HDR 72POS 0.100 STACK T/H Amphenol ICC (FCI)	3,595	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	72	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.455 (11.557mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-111722000LF CONN HDR 72POS 0.100 STACK T/H Amphenol ICC (FCI)	3,578	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	72	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.318 (8.077mm)	0.787 (20.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-111720800LF CONN HDR 72POS 0.100 STACK T/H Amphenol ICC (FCI)	3,106	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	72	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.790 (20.066mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
76745-3DT-52LF CONN HDR 52POS 0.100 STACK TH Amphenol ICC (FCI)	2,071	-	RFQ		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	52	0.100 (2.54mm)	2	0.100 (2.54mm)	1.850 (47.000mm)	0.386 (9.800mm)	1.079 (27.400mm)	0.386 (9.800mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59202-G40-12P155LF CONN HDR STACK SMD Amphenol ICC (FCI)	2,802	-	RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54242-125463400LF CONN HDR STACK Amphenol ICC (FCI)	3,883	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54242-104500950LF CONN HDR 50POS 0.100 STACK SMD Amphenol ICC (FCI)	2,544	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	50	0.100 (2.54mm)	2	0.100 (2.54mm)	0.590 (14.986mm)	0.217 (5.500mm)	0.374 (9.500mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-105500950LF CONN HDR 50POS 0.100 STACK SMD Amphenol ICC (FCI)	3,845	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	50	0.100 (2.54mm)	2	0.100 (2.54mm)	0.625 (15.875mm)	0.251 (6.375mm)	0.374 (9.500mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-106500900LF CONN HDR 50POS 0.100 STACK SMD Amphenol ICC (FCI)	2,918	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	50	0.100 (2.54mm)	2	0.100 (2.54mm)	0.674 (17.120mm)	0.320 (8.128mm)	0.354 (9.000mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-106500950LF CONN HDR 50POS 0.100 STACK SMD Amphenol ICC (FCI)	3,055	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	50	0.100 (2.54mm)	2	0.100 (2.54mm)	0.674 (17.120mm)	0.300 (7.620mm)	0.374 (9.500mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-109401850LF CONN HDR 40POS 0.100 STACK SMD Amphenol ICC (FCI)	2,045	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	40	0.100 (2.54mm)	2	0.100 (2.54mm)	0.955 (24.257mm)	0.227 (5.766mm)	0.728 (18.500mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
10065491-004LF CONN HDR 48P 0.079 STACK SMD Amphenol ICC (FCI)	2,677	-	RFQ		Bag	Minitek®	Active	48	0.079 (2.00mm)	2	0.079 (2.00mm)	0.352 (8.930mm)	0.136 (3.454mm)	0.216 (5.486mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54242-108401600LF CONN HDR 40POS 0.100 STACK SMD Amphenol ICC (FCI)	3,583	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	40	0.100 (2.54mm)	2	0.100 (2.54mm)	0.855 (21.717mm)	0.225 (5.715mm)	0.630 (16.000mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-109361500LF CONN HDR 36POS 0.100 STACK T/H Amphenol ICC (FCI)	2,152	-	RFQ	Ficha técnica	Bulk,Box	BERGSTIK®, MezzSelect™, Basics+	Active	36	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.315 (8.000mm)	0.591 (15.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-111-36LF CONN HDR 36POS 0.100 STACK T/H Amphenol ICC (FCI)	2,518	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	36	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.140 (3.556mm)	0.646 (16.400mm)	0.140 (3.556mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
10065491-006LF CONN HDR 30P 0.079 STACK SMD Amphenol ICC (FCI)	2,538	-	RFQ		Bag	Minitek®	Active	30	0.079 (2.00mm)	2	0.079 (2.00mm)	-	0.138 (3.500mm)	-	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
77709-129LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	2,247	-	RFQ		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	1	-	0.695 (17.650mm)	0.122 (3.100mm)	0.451 (11.450mm)	0.122 (3.100mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-112720800LF CONN HDR 72POS 0.100 STACK T/H Amphenol ICC (FCI)	3,320	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	72	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.890 (22.606mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-104500800LF CONN HDR 50POS 0.100 STACK T/H Amphenol ICC (FCI)	3,858	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	50	0.100 (2.54mm)	2	0.100 (2.54mm)	0.660 (16.764mm)	0.225 (5.715mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)