Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
59202-F36-09A105LF

59202-F36-09A105LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,194 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59202-G26-07A058LF

59202-G26-07A058LF

CONN HDR STACK

Amphenol ICC (FCI)
2,046 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59112-F32-09-048LF

59112-F32-09-048LF

CONN HDR STACK

Amphenol ICC (FCI)
2,469 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-109121650LF

54121-109121650LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,980 -

RFQ

54121-109121650LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 1 - 1.025 (26.035mm) 0.255 (6.477mm) 0.650 (16.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-405160800LF

54122-405160800LF

CONN HDR 16POS 0.100 STACK TH

Amphenol ICC (FCI)
2,492 -

RFQ

54122-405160800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) 0.695 (17.650mm) 0.260 (6.600mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
59112-T38-13-135LF

59112-T38-13-135LF

CONN HDR 26POS 0.079 STACK TH

Amphenol ICC (FCI)
2,044 -

RFQ

59112-T38-13-135LF

Ficha técnica

Bag Minitek® 2.00mm Active 26 0.079 (2.00mm) 2 0.079 (2.00mm) 0.752 (19.100mm) 0.122 (3.100mm) 0.531 (13.500mm) 0.098 (2.500mm) Through Hole Solder Gold 30.0µin (0.76µm)
54122-410261920LF

54122-410261920LF

CONN HDR STACK

Amphenol ICC (FCI)
3,545 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-112202500LF

54122-112202500LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,593 -

RFQ

54122-112202500LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.221 (5.613mm) 0.984 (25.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-106260850LF

54122-106260850LF

CONN HDR 26POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,331 -

RFQ

54122-106260850LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.289 (7.341mm) 0.335 (8.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-128161250LF

54122-128161250LF

CONN HDR STACK

Amphenol ICC (FCI)
3,876 -

RFQ

Bag * Active - - - - - - - - - - - -
54111-109201800LF

54111-109201800LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,386 -

RFQ

54111-109201800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 1 - 1.025 (26.035mm) 0.221 (5.613mm) 0.709 (18.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-809201800LF

54121-809201800LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,302 -

RFQ

54121-809201800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 1 - 1.025 (26.035mm) 0.196 (4.978mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-119261100LF

54112-119261100LF

CONN HDR 26POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,354 -

RFQ

54112-119261100LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 0.882 (22.400mm) 0.354 (9.000mm) 0.433 (11.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-T40-11A160LF

59202-T40-11A160LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,864 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59112-T40-11-143LF

59112-T40-11-143LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,256 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-411321900LF

54122-411321900LF

CONN HDR 32POS 0.100 STACK TH

Amphenol ICC (FCI)
3,513 -

RFQ

54122-411321900LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 32 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.357 (9.068mm) 0.748 (19.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54111-103300800LF

54111-103300800LF

CONN HDR 30POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,614 -

RFQ

54111-103300800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 1 - 0.626 (15.900mm) 0.217 (5.500mm) 0.315 (8.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-103300800LF

54121-103300800LF

CONN HDR 30POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,558 -

RFQ

54121-103300800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 1 - 0.626 (15.900mm) 0.191 (4.851mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54776-107-24LF

54776-107-24LF

CONN HDR 24POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,948 -

RFQ

54776-107-24LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 24 0.100 (2.54mm) 2 0.100 (2.54mm) 1.224 (31.100mm) 0.317 (8.052mm) 0.591 (15.000mm) 0.317 (8.052mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
98426-G13-17-237LF

98426-G13-17-237LF

CONN HDR 34POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,487 -

RFQ

98426-G13-17-237LF

Ficha técnica

Box Minitek® 2.00mm Active 34 0.079 (2.00mm) 2 0.079 (2.00mm) 1.024 (26.000mm) 0.157 (4.000mm) 0.768 (19.500mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 4142434445464748...89Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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