Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
98426-T13-10-214LF

98426-T13-10-214LF

CONN HDR 20POS 0.079 STACK TH

Amphenol ICC (FCI)
2,293 -

RFQ

98426-T13-10-214LF

Ficha técnica

Box Minitek® 2.00mm Active 20 0.079 (2.00mm) 2 0.079 (2.00mm) 1.024 (26.000mm) 0.157 (4.000mm) 0.835 (21.200mm) 0.181 (4.600mm) Through Hole Solder Tin 78.7µin (2.00µm)
98426-T13-10-222LF

98426-T13-10-222LF

CONN HDR 20POS 0.079 STACK TH

Amphenol ICC (FCI)
3,942 -

RFQ

98426-T13-10-222LF

Ficha técnica

Box Minitek® 2.00mm Active 20 0.079 (2.00mm) 2 0.079 (2.00mm) 1.024 (26.000mm) 0.157 (4.000mm) 0.709 (18.000mm) 0.150 (3.800mm) Through Hole Solder Tin 78.7µin (2.00µm)
54112-406261000LF

54112-406261000LF

CONN HDR 26POS 0.100 STACK TH

Amphenol ICC (FCI)
2,980 -

RFQ

54112-406261000LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.255 (6.477mm) 0.394 (10.000mm) 0.095 (2.413mm) Through Hole Solder Tin 78.7µin (2.00µm)
54122-409261800LF

54122-409261800LF

CONN HDR 26POS 0.100 STACK TH

Amphenol ICC (FCI)
2,183 -

RFQ

54122-409261800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.196 (4.978mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
59202-F30-08-080

59202-F30-08-080

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,392 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-F38-05A132LF

59202-F38-05A132LF

CONN HDR 10P 0.079 STACK SMD

Amphenol ICC (FCI)
2,828 -

RFQ

59202-F38-05A132LF

Ficha técnica

Tape & Reel (TR) Minitek® 2.00mm Active 10 0.079 (2.00mm) 2 0.079 (2.00mm) 0.685 (17.400mm) 0.165 (4.200mm) 0.520 (13.200mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
87690-724LF

87690-724LF

CONN HDR 28POS 0.100 STACK TH

Amphenol ICC (FCI)
3,964 -

RFQ

87690-724LF

Ficha técnica

Bulk,Box BERGSTIK® II, MezzSelect™, Basics+ Active 28 0.100 (2.54mm) 2 0.100 (2.54mm) 0.941 (23.900mm) 0.352 (8.950mm) 0.236 (6.000mm) 0.352 (8.941mm) Through Hole Solder Gold Flash
77709-321LF

77709-321LF

CONN HDR 19POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,787 -

RFQ

77709-321LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 19 0.100 (2.54mm) 1 - 1.024 (26.000mm) 0.118 (3.000mm) 0.799 (20.300mm) 0.108 (2.750mm) Through Hole Solder Tin-Lead 150.0µin (3.81µm)
54122-814201800LF

54122-814201800LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,928 -

RFQ

54122-814201800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.040 (26.416mm) 0.211 (5.359mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-108201200LF

54112-108201200LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,279 -

RFQ

54112-108201200LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.358 (9.100mm) 0.472 (12.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-104260800LF

54122-104260800LF

CONN HDR 26POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,210 -

RFQ

54122-104260800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 0.660 (16.764mm) 0.225 (5.715mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
92813-004T

92813-004T

CONN HDR 14P 0.079 STACK SMD

Amphenol ICC (FCI)
3,476 -

RFQ

Tube Minitek® Active 14 0.079 (2.00mm) 2 0.079 (2.00mm) 0.331 (8.400mm) 0.134 (3.400mm) 0.197 (5.000mm) - Surface Mount Solder Gold 15.0µin (0.38µm)
54122-108181400RLF

54122-108181400RLF

CONN HDR 18POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,715 -

RFQ

54122-108181400RLF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 18 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.254 (6.450mm) 0.551 (14.000mm) 0.120 (3.050mm) Through Hole Kinked Pin, Solder Gold, GXT™ 30.0µin (0.76µm)
59202-G24-07A055LF

59202-G24-07A055LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,487 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
54111-802240800LF

54111-802240800LF

CONN HDR 24POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,803 -

RFQ

54111-802240800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 24 0.100 (2.54mm) 1 - 0.531 (13.500mm) 0.122 (3.100mm) 0.315 (8.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
20021834-10020T1LF

20021834-10020T1LF

CONN HDR 20POS 0.05 STACK SMD

Amphenol ICC (FCI)
2,697 -

RFQ

20021834-10020T1LF

Ficha técnica

Tube Minitek127® 20021834 Active 20 0.050 (1.27mm) 2 0.050 (1.27mm) 0.559 (14.200mm) 0.138 (3.500mm) 0.394 (10.000mm) - Surface Mount Solder Gold Flash
54112-806261150LF

54112-806261150LF

CONN HDR 26POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,289 -

RFQ

54112-806261150LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.196 (4.978mm) 0.453 (11.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-107241300LF

54112-107241300LF

CONN HDR 24POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,446 -

RFQ

54112-107241300LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 24 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.219 (5.550mm) 0.512 (13.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-110221700LF

54122-110221700LF

CONN HDR 22POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,308 -

RFQ

54122-110221700LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 22 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.336 (8.534mm) 0.669 (17.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-110221000LF

54122-110221000LF

CONN HDR 22POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,652 -

RFQ

54122-110221000LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 22 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.611 (15.519mm) 0.394 (10.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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