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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS8602BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
3,624 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount | |
|
MC32PF4210A1ESR2PF4210 NXP USA Inc. |
3,137 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | Audio, Video | - | 2.8V ~ 4.5V | 0°C ~ 85°C (TA) | Surface Mount, Wettable Flank |
|
MC33FS6510CAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,810 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MFS8631BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,641 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
MPF7100BVMA1ESPF7100 PMIC I.MX8XL NXP USA Inc. |
2,774 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MPF7100BVMA2ESPF7100 PMIC I.MX8XL NXP USA Inc. |
3,948 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MPF7100BVMA3ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc. |
3,419 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MPF7100BVMA4ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc. |
3,251 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC35FS4500NAER2FS4500 NXP USA Inc. |
3,998 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS4502NAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,237 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MFS8623BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
3,190 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
|
MC33FS6520NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,238 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MFS8600BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,623 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount | |
|
MC34VR5100A0EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,398 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 125°C (TJ) | Surface Mount |
|
|
MC34VR5100A1EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,121 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 125°C (TJ) | Surface Mount |
|
|
MC34VR5100A2EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,410 | - |
RFQ |
Tape & Reel (TR) | - | Active | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 125°C (TJ) | Surface Mount | |
|
|
MC33FS6502NAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,688 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC35FS6500NAER2FS6500 NXP USA Inc. |
2,209 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS6500CAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,983 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC33FS6510LAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
3,285 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
