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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS8620BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,304 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
UJA1132HW/FD/3V/4YBUCK/BOOST HS-CAN/DUAL LIN SYSTE NXP USA Inc. |
2,406 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q100 | Active | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount |
|
MC33813AER2IC CTRL SMALL ENG 1CYL 48LQFP NXP USA Inc. |
3,117 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Small Engine | 10mA | 4.5V ~ 36V | -40°C ~ 125°C | Surface Mount |
|
MC34PF3001A2EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,369 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount |
|
|
MC34PF3001A3EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,491 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount |
|
|
MC34PF3001A4EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,352 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount |
|
|
MC34PF3001A5EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,284 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount |
|
MWCT1012VLFR32BIT 64K FLASH 2KB FLEX NXP USA Inc. |
2,365 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Wireless Power Transmitter | 1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount |
|
MWCT1001A3VLH5W MULTI-COIL CONS QFP NXP USA Inc. |
3,974 | - |
RFQ |
Tray | - | Active | Automotive, Wireless Power Transmitter | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | |
|
MC33FS4500NAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,774 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MFS8622BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
3,948 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
MC32PF8121EUEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,420 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Industrial, IoT | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank |
|
|
MC32PF8121F1EPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,254 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Industrial, IoT | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank |
|
|
MC32PF8121A0EPR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
2,009 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Industrial, IoT | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank |
|
|
MC32PF8121F2EPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,285 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Industrial, IoT | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33FS6500NAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,399 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MFS8620BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,138 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
|
MFS8621BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,492 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
|
MFS8631BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,047 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | |
|
MC32PF3001A2EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,759 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
