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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF3001A7ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,164 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
UJA1131HW/FD/3V/0YBUCK/BOOST HS-CAN/DUAL LIN SYSTE NXP USA Inc. |
2,293 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q100 | Active | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount |
|
MC34912BACIC SYSTEM BASIS CHIP LIN 32-LQFP NXP USA Inc. |
3,000 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | 4.5mA | 5.5V ~ 18V | -40°C ~ 85°C | Surface Mount |
|
MC34PF1550A4EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
3,072 | - |
RFQ |
Tray | - | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | |
|
MC33912BACIC SYSTEM BASIS CHIP 32LQFP NXP USA Inc. |
2,359 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount |
|
|
MC32PF3001A1EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,580 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MC32PF3001A2EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,824 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MC32PF3001A3EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,378 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MC32PF3001A4EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,418 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MC32PF3001A5EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,955 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
MWCT1011CFM15W SINGLE-COIL CONSUMER STAND NXP USA Inc. |
2,810 | - |
RFQ |
Bulk,Tray | - | Active | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C | Surface Mount, Wettable Flank | |
|
|
UJA1131HW/FD/3V/4YBUCK/BOOST HS-CAN/DUAL LIN SYSTE NXP USA Inc. |
2,523 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q100 | Active | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount |
|
MPF5024AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
3,176 | - |
RFQ |
Tape & Reel (TR) | - | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MPF5024AVNA0ESR2PF5024 NXP USA Inc. |
2,632 | - |
RFQ |
Tape & Reel (TR) | - | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC34PF3001A6EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
3,633 | - |
RFQ |
Ficha técnica |
Bulk,Tray | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount |
|
|
MC32PF3001A6EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,268 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
UJA1131HW/5V0,518IC TRANSCEIVER NXP USA Inc. |
2,442 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount |
|
MWCT1011VLH15W MULTI-COIL CONS QFP NXP USA Inc. |
2,134 | - |
RFQ |
Bulk,Tray | - | Active | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | |
|
|
MC33PF3001A6ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,406 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
|
|
MC33PF3001A7ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,704 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
