Integrado - Sistema en chip (SoC)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus Architecture CoreProcessor FlashSize RAMSize Peripherals Connectivity Speed PrimaryAttributes OperatingTemperature
XCZU2EG-2UBVA530E

XCZU2EG-2UBVA530E

IC ZUP MPSOC A53 FPGA 530BGA

AMD Xilinx
2,261 -

RFQ

XCZU2EG-2UBVA530E

Ficha técnica

530-WFBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 0°C ~ 100°C (TJ)
XCZU2EG-L1UBVA530I

XCZU2EG-L1UBVA530I

IC ZUP MPSOC A53 FPGA LP 530BGA

AMD Xilinx
2,344 -

RFQ

XCZU2EG-L1UBVA530I

Ficha técnica

530-WFBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ)
XC7Z030-1SB485I

XC7Z030-1SB485I

IC SOC CORTEX-A9 667MHZ 485FCBGA

AMD Xilinx
2,938 -

RFQ

XC7Z030-1SB485I

Ficha técnica

484-FBGA, FCBGA Bulk Zynq®-7000 Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ)
XCZU1EG-2SFVC784E

XCZU1EG-2SFVC784E

IC ZUP MPSOC A53 FPGA 784BGA

AMD Xilinx
3,658 -

RFQ

XCZU1EG-2SFVC784E

Ficha técnica

784-BFBGA, FCBGA Tray Zynq® UltraScale+™ Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz - 0°C ~ 100°C (TJ)
XCZU1EG-L1SFVC784I

XCZU1EG-L1SFVC784I

IC ZUP MPSOC LP A53 FPGA 784BGA

AMD Xilinx
3,475 -

RFQ

XCZU1EG-L1SFVC784I

Ficha técnica

784-BFBGA, FCBGA Tray Zynq® UltraScale+™ Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 500MHz, 600MHz, 1.2GHz - -40°C ~ 100°C (TJ)
M2S050TS-1FG484M

M2S050TS-1FG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
2,401 -

RFQ

M2S050TS-1FG484M

Ficha técnica

484-BGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -55°C ~ 125°C (TJ)
M2S050TS-1FGG484M

M2S050TS-1FGG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
3,582 -

RFQ

M2S050TS-1FGG484M

Ficha técnica

484-BGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -55°C ~ 125°C (TJ)
XAZU2EG-1SFVA625I

XAZU2EG-1SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD Xilinx
2,707 -

RFQ

XAZU2EG-1SFVA625I

Ficha técnica

625-BFBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 1.2MB DMA, WDT CANbus, I²C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ)
XC7Z030-3FBG484E

XC7Z030-3FBG484E

IC SOC CORTEX-A9 1GHZ 484FCBGA

AMD Xilinx
2,790 -

RFQ

XC7Z030-3FBG484E

Ficha técnica

484-BBGA, FCBGA Tray Zynq®-7000 Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1GHz Kintex™-7 FPGA, 125K Logic Cells 0°C ~ 100°C (TJ)
XC7Z030-L2FBG484I

XC7Z030-L2FBG484I

IC SOC CORTEX-A9 800MHZ 484FCBGA

AMD Xilinx
3,828 -

RFQ

XC7Z030-L2FBG484I

Ficha técnica

484-BBGA, FCBGA Tray Zynq®-7000 Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ)
XCZU2EG-1SFVC784I

XCZU2EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD Xilinx
2,771 -

RFQ

XCZU2EG-1SFVC784I

Ficha técnica

784-BFBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ)
M2S150-1FCV484

M2S150-1FCV484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
2,370 -

RFQ

M2S150-1FCV484

Ficha técnica

484-BFBGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ)
M2S150-1FCVG484

M2S150-1FCVG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
3,537 -

RFQ

M2S150-1FCVG484

Ficha técnica

484-BFBGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ)
M2S150-FCV484I

M2S150-FCV484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
2,575 -

RFQ

M2S150-FCV484I

Ficha técnica

484-BFBGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ)
XCZU3CG-1SFVA625E

XCZU3CG-1SFVA625E

IC SOC CORTEX-A53 625FCBGA

AMD Xilinx
2,262 -

RFQ

XCZU3CG-1SFVA625E

Ficha técnica

625-BFBGA, FCBGA Bulk Zynq® UltraScale+™ MPSoC CG Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ)
XCZU4EV-1FBVB900I

XCZU4EV-1FBVB900I

IC SOC CORTEX-A53 900FCBGA

AMD Xilinx
3,588 -

RFQ

XCZU4EV-1FBVB900I

Ficha técnica

900-BBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EV Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells -40°C ~ 100°C (TJ)
XCZU5CG-1FBVB900E

XCZU5CG-1FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD Xilinx
3,152 -

RFQ

XCZU5CG-1FBVB900E

Ficha técnica

900-BBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC CG Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 0°C ~ 100°C (TJ)
XCZU4EG-2FBVB900E

XCZU4EG-2FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD Xilinx
2,998 -

RFQ

XCZU4EG-2FBVB900E

Ficha técnica

900-BBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 0°C ~ 100°C (TJ)
XCZU4EG-L1FBVB900I

XCZU4EG-L1FBVB900I

IC SOC CORTEX-A53 900FCBGA

AMD Xilinx
3,534 -

RFQ

XCZU4EG-L1FBVB900I

Ficha técnica

900-BBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells -40°C ~ 100°C (TJ)
XCZU5EG-1SFVC784I

XCZU5EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD Xilinx
2,677 -

RFQ

XCZU5EG-1SFVC784I

Ficha técnica

784-BFBGA, FCBGA Tray Zynq® UltraScale+™ MPSoC EG Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells -40°C ~ 100°C (TJ)
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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