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Integrado - Sistema en chip (SoC)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Package/Case	Packaging	Series	ProductStatus	Architecture	CoreProcessor	FlashSize	RAMSize	Peripherals	Connectivity	Speed	PrimaryAttributes	OperatingTemperature
M2S090-1FG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	2,913	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
M2S090-1FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,977	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
M2S090-FG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,146	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
M2S090-FGG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,800	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
XCZU2EG-1SBVA484E IC SOC CORTEX-A53 484FCBGA AMD Xilinx	3,560	-	RFQ	Ficha técnica	484-BFBGA, FCBGA	Tray	Zynq® UltraScale+™ MPSoC EG	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	0°C ~ 100°C (TJ)
M2S090-1FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,403	-	RFQ	Ficha técnica	484-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
M2S090-1FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	3,334	-	RFQ	Ficha técnica	484-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
XCZU1CG-2SBVA484E IC ZUP MPSOC A53 FPGA 484BGA AMD Xilinx	3,463	-	RFQ	Ficha técnica	484-BFBGA, FCBGA	Tray	Zynq® UltraScale+™	Active	MPU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	-	533MHz, 1.333GHz	-	0°C ~ 100°C (TJ)
XCZU1CG-L1SBVA484I IC ZUP MPSOC LP A53 FPGA 484BGA AMD Xilinx	3,311	-	RFQ	Ficha técnica	484-BFBGA, FCBGA	Tray	Zynq® UltraScale+™	Active	MPU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	-	500MHz, 1.2GHz	-	-40°C ~ 100°C (TJ)
BCM53575B0IFSBG 24X1G + 4X10G L2 TSN SWITCH Broadcom Limited	2,165	-	RFQ		-	Tray	-	Active	MPU	ARM® Cortex®-A9, ARM® Cortex®-R5	-	-	SERDES	ACL, MAC, QSGMII	1.25GHz	-	-
XCZU2EG-1SFVA625E IC SOC CORTEX-A53 625FCBGA AMD Xilinx	2,893	-	RFQ	Ficha técnica	625-BFBGA, FCBGA	Tray	Zynq® UltraScale+™ MPSoC EG	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	0°C ~ 100°C (TJ)
M2S090T-1FG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,972	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
M2S090T-1FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,179	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
M2S090T-FG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,979	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
M2S090T-FGG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	2,357	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)
M2S090TS-FG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,849	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
M2S090TS-FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	2,175	-	RFQ	Ficha técnica	676-BGA	Tray	SmartFusion®2	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I²C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)
XCZU2EG-1SFVC784E IC SOC CORTEX-A53 784FCBGA AMD Xilinx	3,328	-	RFQ	Ficha técnica	784-BFBGA, FCBGA	Tray	Zynq® UltraScale+™ MPSoC EG	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	0°C ~ 100°C (TJ)
XCZU1CG-2SFVA625E IC ZUP MPSOC A53 FPGA 625BGA AMD Xilinx	2,114	-	RFQ	Ficha técnica	625-BFBGA, FCBGA	Tray	Zynq® UltraScale+™	Active	MPU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	-	533MHz, 1.333GHz	-	0°C ~ 100°C (TJ)
XCZU1CG-L1SFVA625I IC ZUP MPSOC LP A53 FPGA 625BGA AMD Xilinx	2,588	-	RFQ	Ficha técnica	625-BFBGA, FCBGA	Tray	Zynq® UltraScale+™	Active	MPU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	-	500MHz, 1.2GHz	-	-40°C ~ 100°C (TJ)