Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
ICO-308-SGT

ICO-308-SGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.
2,865 -

RFQ

ICO-308-SGT

Ficha técnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-632-STT

ICA-632-STT

CONN IC DIP SOCKET 32POS TIN

Samtec Inc.
485 -

RFQ

ICA-632-STT

Ficha técnica

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-628-SST

ICA-628-SST

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.
394 -

RFQ

ICA-628-SST

Ficha técnica

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyester
ICO-628-NTT

ICO-628-NTT

100 LOW PROFILE SCREW MACHINE D

Samtec Inc.
583 -

RFQ

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-628-SGT

ICO-628-SGT

CONN IC DIP SKT 28POS

Samtec Inc.
2,590 -

RFQ

ICO-628-SGT

Ficha técnica

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-628-SGT

ICA-628-SGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.
497 -

RFQ

ICA-628-SGT

Ficha técnica

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
APA-628-G-N

APA-628-G-N

ADAPTER PLUG

Samtec Inc.
180 -

RFQ

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICA-308-STT

ICA-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
3,040 -

RFQ

ICA-308-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-318-STT

ICA-318-STT

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.
1,054 -

RFQ

ICA-318-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICF-328-T-O-TR

ICF-328-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
350 -

RFQ

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICF-628-T-O

ICF-628-T-O

CONN IC DIP SOCKET 28POS TIN

Samtec Inc.
245 -

RFQ

ICF-628-T-O

Ficha técnica

Tube iCF Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICA-324-SST

ICA-324-SST

.100 SCREW MACHINE DIP SOCKET

Samtec Inc.
930 -

RFQ

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-320-SGT

ICO-320-SGT

CONN IC DIP SOCKET 20POS GOLD

Samtec Inc.
840 -

RFQ

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-632-SST

ICA-632-SST

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.
364 -

RFQ

ICA-632-SST

Ficha técnica

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled
ICA-316-ZAGT

ICA-316-ZAGT

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.
163 -

RFQ

ICA-316-ZAGT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyester, Glass Filled
ICO-316-NGT

ICO-316-NGT

100 LOW PROFILE SCREW MACHINE D

Samtec Inc.
249 -

RFQ

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
APA-316-G-A1

APA-316-G-A1

ADAPTER PLUG

Samtec Inc.
200 -

RFQ

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICO-628-NGT

ICO-628-NGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.
121 -

RFQ

ICO-628-NGT

Ficha técnica

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICF-308-S-O-TR

ICF-308-S-O-TR

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
350 -

RFQ

ICF-308-S-O-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICF-624-T-O-TR

ICF-624-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
271 -

RFQ

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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