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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
APA-316-G-P ADAPTER PLUG Samtec Inc.	3,655	-	RFQ		Tube	APA	Active	-	16 (2 x 8)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
APA-640-T-B ADAPTER PLUG Samtec Inc.	100	-	RFQ		Bulk	APA	Active	-	40 (2 x 20)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A1 ADAPTER PLUG Samtec Inc.	100	-	RFQ		Bulk	APA	Active	-	40 (2 x 20)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A ADAPTER PLUG Samtec Inc.	100	-	RFQ		Bulk	APA	Active	-	40 (2 x 20)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICF-308-T-O-TR CONN IC DIP SOCKET 8POS TIN Samtec Inc.	187	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
ICF-316-T-O-TR CONN IC DIP SOCKET 16POS TIN Samtec Inc.	3,225	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
APA-628-G-A1 ADAPTER PLUG Samtec Inc.	3,141	-	RFQ		Bulk	APA	Active	-	28 (2 x 14)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICO-314-SGT CONN IC DIP SKT 14POS Samtec Inc.	3,253	-	RFQ	Ficha técnica	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICA-316-STT CONN IC DIP SOCKET 16POS TIN Samtec Inc.	3,650	-	RFQ	Ficha técnica	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICF-628-T-O-TR CONN IC DIP SOCKET 28POS TIN Samtec Inc.	2,226	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	iCF	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
ICA-320-SGT CONN IC DIP SOCKET 20POS GOLD Samtec Inc.	3,371	-	RFQ	Ficha técnica	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICO-628-CTT CONN IC DIP SKT .100 Samtec Inc.	3,188	-	RFQ		Tube	ICO	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICA-320-SGG CONN IC DIP SOCKET 20POS GOLD Samtec Inc.	3,179	-	RFQ	Ficha técnica	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled
ICA-324-STT CONN IC DIP SOCKET 24POS TIN Samtec Inc.	3,469	-	RFQ	Ficha técnica	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICF-308-T-I-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	2,132	-	RFQ		Tape & Reel (TR)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
ICF-308-TM-O-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	2,570	-	RFQ		Tape & Reel (TR)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
ICO-308-STT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	3,033	-	RFQ	Ficha técnica	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICO-308-LTT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	3,860	-	RFQ	Ficha técnica	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICO-314-STT CONN IC DIP SOCKET 14POS TIN Samtec Inc.	2,586	-	RFQ	Ficha técnica	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
ICF-314-T-O-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	3,312	-	RFQ		Tape & Reel (TR)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)