Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
APA-316-G-P

APA-316-G-P

ADAPTER PLUG

Samtec Inc.
3,655 -

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-T-B

APA-640-T-B

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A1

APA-640-G-A1

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-640-G-A

APA-640-G-A

ADAPTER PLUG

Samtec Inc.
100 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICF-308-T-O-TR

ICF-308-T-O-TR

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
187 -

RFQ

ICF-308-T-O-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICF-316-T-O-TR

ICF-316-T-O-TR

CONN IC DIP SOCKET 16POS TIN

Samtec Inc.
3,225 -

RFQ

ICF-316-T-O-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
APA-628-G-A1

APA-628-G-A1

ADAPTER PLUG

Samtec Inc.
3,141 -

RFQ

Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICO-314-SGT

ICO-314-SGT

CONN IC DIP SKT 14POS

Samtec Inc.
3,253 -

RFQ

ICO-314-SGT

Ficha técnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-316-STT

ICA-316-STT

CONN IC DIP SOCKET 16POS TIN

Samtec Inc.
3,650 -

RFQ

ICA-316-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICF-628-T-O-TR

ICF-628-T-O-TR

CONN IC DIP SOCKET 28POS TIN

Samtec Inc.
2,226 -

RFQ

ICF-628-T-O-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICA-320-SGT

ICA-320-SGT

CONN IC DIP SOCKET 20POS GOLD

Samtec Inc.
3,371 -

RFQ

ICA-320-SGT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-628-CTT

ICO-628-CTT

CONN IC DIP SKT .100

Samtec Inc.
3,188 -

RFQ

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICA-320-SGG

ICA-320-SGG

CONN IC DIP SOCKET 20POS GOLD

Samtec Inc.
3,179 -

RFQ

ICA-320-SGG

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled
ICA-324-STT

ICA-324-STT

CONN IC DIP SOCKET 24POS TIN

Samtec Inc.
3,469 -

RFQ

ICA-324-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICF-308-T-I-TR

ICF-308-T-I-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
2,132 -

RFQ

Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICF-308-TM-O-TR

ICF-308-TM-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
2,570 -

RFQ

Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
ICO-308-STT

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
3,033 -

RFQ

ICO-308-STT

Ficha técnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-308-LTT

ICO-308-LTT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
3,860 -

RFQ

ICO-308-LTT

Ficha técnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-314-STT

ICO-314-STT

CONN IC DIP SOCKET 14POS TIN

Samtec Inc.
2,586 -

RFQ

ICO-314-STT

Ficha técnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICF-314-T-O-TR

ICF-314-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
3,312 -

RFQ

Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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