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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4808-3004-CPCONN IC DIP SOCKET 8POS TIN 3M |
55,712 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
8432-21B1-RK-TRCONN SOCKET PLCC 32POS TIN 3M |
17,368 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8444-21B1-RK-TRCONN SOCKET PLCC 44POS TIN 3M |
29,289 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8444-11B1-RK-TPCONN SOCKET PLCC 44POS TIN 3M |
10,621 | - |
RFQ |
Ficha técnica |
Tube | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
214-3339-00-0602JCONN IC DIP SOCKET ZIF 14POS GLD 3M |
189 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
224-1275-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD 3M |
2,825 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-3342-00-0602JCONN IC DIP SOCKET ZIF 20POS GLD 3M |
2,032 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
208-7391-55-1902CONN SOCKET SOIC 8POS GOLD 3M |
325 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 8 (2 x 4) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
248-1282-00-0602JCONN IC DIP SOCKET ZIF 48POS GLD 3M |
181 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
216-7224-55-1902CONN SOCKET SOIC 16POS GOLD 3M |
345 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
203-2737-55-1102CONN TRANSIST TO-3/TO-66 3POS 3M |
295 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | Transistor, TO-3 and TO-66 | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234 (5.94mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
210-2599-00-0602CONN SOCKET SIP ZIF 10POS GOLD 3M |
210 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-2600-00-0602CONN SOCKET SIP ZIF 20POS GOLD 3M |
496 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
4816-3000-CPCONN IC DIP SOCKET 16POS TIN 3M |
20,763 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4808-3000-CPCONN IC DIP SOCKET 8POS TIN 3M |
10,438 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4814-3000-CPCONN IC DIP SOCKET 14POS TIN 3M |
8,250 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4814-3004-CPCONN IC DIP SOCKET 14POS TIN 3M |
4,063 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4816-3004-CPCONN IC DIP SOCKET 16POS TIN 3M |
17,629 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4818-3000-CPCONN IC DIP SOCKET 18POS TIN 3M |
2,646 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4818-3004-CPCONN IC DIP SOCKET 18POS TIN 3M |
7,644 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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