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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
ICS-306-T IC SOCKET, DIP, 6P 2.54MM PITCH Adam Tech	9,260	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-308-T IC SOCKET, DIP, 8P 2.54MM PITCH Adam Tech	17,355	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-314-T IC SOCKET, DIP, 14P 2.54MM PITCH Adam Tech	4,669	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-318-T IC SOCKET, DIP, 18P 2.54MM PITCH Adam Tech	651	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-320-T IC SOCKET, DIP, 20P 2.54MM PITCH Adam Tech	3,595	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-324-T IC SOCKET, DIP, 24P 2.54MM PITCH Adam Tech	3,975	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-328-T IC SOCKET, DIP, 28P 2.54MM PITCH Adam Tech	11,368	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-628-T IC SOCKET, DIP, 28P 2.54MM PITCH Adam Tech	1,601	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-632-T IC SOCKET, DIP, 32P 2.54MM PITCH Adam Tech	3,101	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-640-T IC SOCKET, DIP, 40P 2.54MM PITCH Adam Tech	3,776	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-308-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 8P Adam Tech	1,554	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-32-AT-SMT PLCC SOCKET 32P SMT Adam Tech	2,589	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
PLCC-44-AT-SMT PLCC SOCKET 44P SMT Adam Tech	3,219	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Thermoplastic
ICM-642-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 42P Adam Tech	1,083	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-28-AT PLCC 28P THROUGH HOLE Adam Tech	2,226	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
PLCC-44-AT PLCC 44P THROUGH HOLE Adam Tech	2,349	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-306-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 6P Adam Tech	360	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICM-318-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 18P Adam Tech	430	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICM-320-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 20P Adam Tech	140	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICM-624-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 24P Adam Tech	401	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)