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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
PLCC-20-AT PLCC 20P THROUGH HOLE Adam Tech	637	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-628-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech	240	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-32-AT PLCC 32P THROUGH HOLE Adam Tech	3,665	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-328-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech	2,946	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-68-AT-SMT CONN SOCKET PLCC 68POS PHOS BRNZ Adam Tech	323	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-632-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 32P Adam Tech	365	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-84-AT PLCC 84P THROUGH HOLE Adam Tech	116	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-640-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 40P Adam Tech	479	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICM-648-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 48P Adam Tech	851	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-52-AT PLCC 52P THROUGH HOLE Adam Tech	275	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
PLCC-68-AT PLCC 68P THROUGH HOLE Adam Tech	1,216	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-324-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 24P Adam Tech	190	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-84-AT-SMT PLCC SOCKET 84P SMT Adam Tech	448	-	RFQ	Ficha técnica	Tube	PLCC	Active	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-316-T IC SOCKET, DIP, 16P 2.54MM PITCH Adam Tech	3,843	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICS-624-T IC SOCKET, DIP, 24P 2.54MM PITCH Adam Tech	2,879	-	RFQ	Ficha técnica	Tube	ICS	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
ICM-314-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 14P Adam Tech	2,863	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICM-316-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 16P Adam Tech	3,843	-	RFQ	Ficha técnica	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)