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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XL25W-TO247-22-17-1CERAMIC HEAT SPREADER 22X17MM WH t-Global Technology |
882 | - |
RFQ |
Ficha técnica |
Bulk | XL-25 | Active | Heat Spreader | Thermal Tape, Adhesive (Included) | Rectangular | 0.866 (22.00mm) | 0.669 (17.00mm) | - | 0.039 (1.00mm) | - | - | - | Ceramic | |
|
XL25W-TO3P-25-20-0.64CERAMIC HEAT SPREADER 25X20MM WH t-Global Technology |
207 | - |
RFQ |
Ficha técnica |
Bulk | XL-25 | Active | Heat Spreader | Thermal Tape, Adhesive (Included) | Rectangular | 0.984 (25.00mm) | 0.787 (20.00mm) | - | 0.025 (0.64mm) | - | - | - | Ceramic | |
|
|
XL25W-TO3P-25-20-1CERAMIC HEAT SPREADER 25X20MM WH t-Global Technology |
177 | - |
RFQ |
Ficha técnica |
Bulk | XL-25 | Active | Heat Spreader | Thermal Tape, Adhesive (Included) | Rectangular | 0.984 (25.00mm) | 0.787 (20.00mm) | - | 0.039 (1.00mm) | - | - | - | Ceramic | |
|
NTE403HEAT SINK PLAST.PWR TRANS NTE Electronics, Inc |
184 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.000 (25.40mm) | 0.710 (18.03mm) | - | 0.500 (12.70mm) | - | - | 20.30°C/W | Aluminum Alloy | |
|
ATS-PCB1072HEATSINK TO-220 BLACK Advanced Thermal Solutions Inc. |
478 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.750 (19.05mm) | 0.520 (13.21mm) | - | 0.500 (12.70mm) | - | 9.50°C/W @ 200 LFM | 24.40°C/W | Aluminum | |
|
NTE448ECLIP-ON H/S FOR 24PIN DIP NTE Electronics, Inc |
3,335 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | Press Fit | Rectangular, Angled Fins | 1.460 (37.08mm) | 1.008 (25.60mm) | - | 0.580 (14.73mm) | - | - | 20.00°C/W | Aluminum Alloy | |
|
HSS-B20-061H-02HEATSINK TO-220 2.9W ALUMINUM CUI Devices |
214 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.500 (12.70mm) | 0.504 (12.80mm) | - | 0.748 (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Aluminum | |
|
TGH-0132-01ALUMINIUM HEAT SINK 19X13.2MM t-Global Technology |
2,504 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.748 (19.00mm) | 0.520 (13.21mm) | - | 0.382 (9.70mm) | - | - | - | Aluminum | |
|
HSS-B20-095HHEATSINK TO-220 4.1W ALUMINUM CUI Devices |
338 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.441 (11.20mm) | 0.866 (22.00mm) | - | 0.626 (15.90mm) | 4.1W @ 75°C | 6.50°C/W @ 200 LFM | 18.34°C/W | Aluminum | |
|
HSB13-303014HEAT SINK, BGA, 30.7 X 30.7 X 14 CUI Devices |
524 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 1.209 (30.70mm) | 1.209 (30.70mm) | - | 0.551 (14.00mm) | 6.1W @ 75°C | 4.70°C/W @ 200 LFM | 12.36°C/W | Aluminum Alloy | |
|
HSS-B20-NP-15HEATSINK TO-220 4.1W ALUMINUM CUI Devices |
376 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level | - | Rectangular, Fins | 0.625 (15.90mm) | 0.866 (22.00mm) | - | 0.440 (11.18mm) | 4.1W @ 75°C | 6.50°C/W @ 200 LFM | 18.34°C/W | Aluminum | |
|
TGH-0160-01ALUMINIUM HEAT SINK 16X16MM t-Global Technology |
2,468 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Fins | 0.630 (16.00mm) | 0.630 (16.00mm) | - | 0.433 (11.00mm) | - | - | - | Aluminum | |
|
HSS06-C20-P32HEAT SINK, STAMPING, TO-220, 27. CUI Devices |
439 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | PC Pin | Rectangular | 1.101 (27.96mm) | 0.866 (22.00mm) | - | 0.375 (9.52mm) | 3.0W @ 75°C | 10.60°C/W @ 200 LFM | 25.35°C/W | Copper Alloy | |
|
TGH-0190-01ALUMINIUM HEAT SINK 19X19MM t-Global Technology |
124 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Fins | 0.748 (19.00mm) | 0.748 (19.00mm) | - | 0.197 (5.00mm) | - | - | - | Aluminum | |
|
TGH-0220-06ALUMINIUM HEAT SINK 27X22MM t-Global Technology |
3,033 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Rectangular, Pin Fins | 1.063 (27.00mm) | 0.866 (22.00mm) | - | 0.354 (9.00mm) | - | - | - | Aluminum | |
|
NTE495HEATSINK FOR PLASTIC PWR NTE Electronics, Inc |
3,884 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level, Vertical | - | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | - | 13.00°C/W | Aluminum Alloy | |
|
ATS-PCBT1080HEATSINK TO-218/TO-220 BLACK Advanced Thermal Solutions Inc. |
660 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.772 (45.00mm) | 1.220 (30.99mm) | - | 0.500 (12.70mm) | - | 9.00°C/W @ 200 LFM | 13.00°C/W | Aluminum | |
|
ATS-PCB1046HEATSINK TO-220/TO-218 W/TAB Advanced Thermal Solutions Inc. |
630 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.622 (41.20mm) | 1.700 (43.18mm) | - | 0.500 (12.70mm) | - | 6.30°C/W @ 200 LFM | 8.60°C/W | Aluminum | |
|
ATS-PCB1048HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc. |
891 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.678 (42.62mm) | 0.984 (25.00mm) | - | 0.984 (25.00mm) | - | 8.00°C/W @ 200 LFM | 13.00°C/W | Aluminum | |
|
HSS08-B18-CPHEAT SINK, STAMPING, TO-218, 44. CUI Devices |
990 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | PC Pin | Square | 1.750 (44.45mm) | 1.750 (44.45mm) | - | 0.492 (12.50mm) | 10.3W @ 75°C | 3.50°C/W @ 200 LFM | 7.29°C/W | Aluminum Alloy |
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