Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
ATS-61600K-C2-R0

ATS-61600K-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,001 -

RFQ

ATS-61600K-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.480 (63.00mm) 2.480 (62.99mm) - 0.571 (14.50mm) - - - -
ATS-61600R-C2-R0

ATS-61600R-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
3,933 -

RFQ

ATS-61600R-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.480 (63.00mm) 2.480 (63.00mm) - 0.768 (19.50mm) - - - -
ATS-X53450R-C1-R0

ATS-X53450R-C1-R0

STR FIN 44.25X44.25X19.5MM T766

Advanced Thermal Solutions Inc.
3,845 -

RFQ

Bulk * Active - - - - - - - - - - -
ATS-X51400R-C1-R0

ATS-X51400R-C1-R0

MAXIFLOW 39.25X39.25X19.5MM T766

Advanced Thermal Solutions Inc.
3,994 -

RFQ

Bulk * Active - - - - - - - - - - -
127690

127690

4.000 X 12 H STYLE HEATSINK XX

Wakefield-Vette
3,258 -

RFQ

127690

Ficha técnica

Box - Active Board Level, Extrusion Bolt On Rectangular, Fins 12.000 (304.80mm) 4.000 (101.60mm) - 1.250 (31.75mm) - - 0.58°C/W Aluminum
127788

127788

2.00 WIDE X 36 CENTER CHANNEL

Wakefield-Vette
3,829 -

RFQ

127788

Ficha técnica

Box - Active Board Level, Extrusion Press Fit Rectangular, Fins 36.000 (914.40mm) 2.000 (50.80mm) - 0.562 (14.28mm) - - 1.63°C/W Aluminum
ATS-61700D-C2-R0

ATS-61700D-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,021 -

RFQ

ATS-61700D-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.913 (74.00mm) 2.913 (74.00mm) - 0.374 (9.50mm) - - - -
ATS-61700K-C2-R0

ATS-61700K-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
3,727 -

RFQ

ATS-61700K-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.913 (74.00mm) 2.913 (74.00mm) - 0.571 (14.50mm) - - - -
ATS-61700R-C2-R0

ATS-61700R-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,927 -

RFQ

ATS-61700R-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.913 (74.00mm) 2.913 (74.00mm) - 0.768 (19.50mm) - - - -
ATS-61700W-C2-R0

ATS-61700W-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,164 -

RFQ

ATS-61700W-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 2.913 (74.00mm) 2.913 (74.00mm) - 0.965 (24.50mm) - - - -
125385

125385

5WX12 EXTRUSION 16936 XX7330

Wakefield-Vette
2,680 -

RFQ

125385

Ficha técnica

Box - Active Board Level, Extrusion Bolt On Rectangular, Fins 12.000 (304.80mm) 5.000 (127.00mm) - 2.500 (63.50mm) - - 0.43°C/W Aluminum
647062

647062

INTEL XEON CPU COOLER 1U

Aavid, Thermal Division of Boyd Corporation
3,347 -

RFQ

Tray - Active Top Mount, Zipper Fin Bolt On Rectangular, Fins 4.252 (108.00mm) 3.071 (78.00mm) - 1.004 (25.50mm) - - - -
127733

127733

5.64 WIDE X 12 MULTI CHANNEL 7

Wakefield-Vette
2,393 -

RFQ

127733

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 5.640 (143.26mm) - 1.000 (25.40mm) - - 0.57°C/W Aluminum
ATS-61800K-C2-R0

ATS-61800K-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
3,965 -

RFQ

ATS-61800K-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 3.307 (84.00mm) 3.307 (84.00mm) - 0.571 (14.50mm) - - - -
ATS-61800R-C2-R0

ATS-61800R-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,638 -

RFQ

ATS-61800R-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 3.307 (84.00mm) 3.307 (84.00mm) - 0.768 (19.50mm) - - - -
ATS-61800D-C2-R0

ATS-61800D-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
2,458 -

RFQ

ATS-61800D-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 3.307 (84.00mm) 3.307 (84.00mm) - 0.374 (9.50mm) - - - -
ATS-61800W-C2-R0

ATS-61800W-C2-R0

FANSINK ASSEMBLY W/ MOUNTING HAR

Advanced Thermal Solutions Inc.
3,121 -

RFQ

ATS-61800W-C2-R0

Ficha técnica

Bulk fanSINK™ Active Top Mount Push Pin, Thermal Material Square, Pin Fins 3.307 (84.00mm) 3.307 (84.00mm) - 0.965 (24.50mm) - - - -
512-3U

512-3U

HEATSINK FOR PWR MOD/IGBT/RELAY

Wakefield-Vette
2,491 -

RFQ

512-3U

Ficha técnica

Bulk 512 Active Top Mount Adhesive Rectangular, Fins 3.000 (76.20mm) 7.200 (182.88mm) - 2.410 (61.21mm) - - 0.90°C/W Aluminum
127790

127790

4.75 WIDE X 36 CENTER CHANNEL

Wakefield-Vette
2,890 -

RFQ

127790

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 4.750 (120.65mm) - 0.461 (11.70mm) - - 0.83°C/W Aluminum
127748

127748

1.26 X 36 FLATBACK HEATSINK EX

Wakefield-Vette
2,037 -

RFQ

127748

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 1.260 (32.00mm) - 1.650 (41.91mm) - - 1.10°C/W Aluminum
Total 113324 Record«Prev1... 8990919293949596...5667Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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