Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
ATS-PCB1035

ATS-PCB1035

HEATSINK TO-220 W/TAB BLACK

Advanced Thermal Solutions Inc.
2,355 -

RFQ

ATS-PCB1035

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) - 7.30°C/W @ 200 LFM 12.50°C/W Aluminum
642-45AB

642-45AB

HEATSINK CPU 35MM SQ H=.45 BLK

Wakefield-Vette
566 -

RFQ

642-45AB

Ficha técnica

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.450 (11.43mm) - 6.00°C/W @ 500 LFM - Aluminum
374024B00035G

374024B00035G

HEATSINK BGA 23X23X10MM W/ADH

Aavid, Thermal Division of Boyd Corporation
111 -

RFQ

374024B00035G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.906 (23.01mm) 0.906 (23.01mm) - 0.394 (10.00mm) 1.0W @ 40°C 11.70°C/W @ 200 LFM 40.00°C/W Aluminum
TGH-0130-01

TGH-0130-01

ALUMINIUM HEAT SINK 13X13MM

t-Global Technology
273 -

RFQ

TGH-0130-01

Ficha técnica

Bulk - Active Top Mount - Square, Fins 0.512 (13.00mm) 0.512 (13.00mm) - 0.236 (6.00mm) - - - Aluminum
TGH-0075-01

TGH-0075-01

ALUMINIUM HEAT SINK 7.5X7.5MM

t-Global Technology
113 -

RFQ

TGH-0075-01

Ficha técnica

Bulk - Active Top Mount - Square, Fins 0.295 (7.50mm) 0.295 (7.50mm) - 0.394 (10.00mm) - - - Aluminum
125367

125367

4.125X12 EXTRUSION 2656 XX5138

Wakefield-Vette
2,356 -

RFQ

125367

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 4.125 (104.77mm) - 1.750 (44.45mm) - - 0.48°C/W Aluminum
125403

125403

5.375X12 EXTRUSION 6037 XX5045

Wakefield-Vette
3,905 -

RFQ

125403

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 5.375 (136.53mm) - 1.312 (33.32mm) - - 0.45°C/W Aluminum
615652F00000G

615652F00000G

61565 EXTRUSION 0.19X0.25X4'

Aavid, Thermal Division of Boyd Corporation
3,614 -

RFQ

615652F00000G

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Pin Fins 48.000 (1219.20mm) 0.250 (6.35mm) - 0.190 (4.83mm) - 21.20°C/W @ 200 LFM - Aluminum
510-3U

510-3U

HEATSINK FOR PWR MOD/IGBT/RELAY

Wakefield-Vette
2,117 -

RFQ

510-3U

Ficha técnica

Bulk 510 Active Top Mount Adhesive Rectangular, Fins 3.000 (76.20mm) 7.380 (187.45mm) - 3.136 (79.65mm) - - 0.56°C/W Aluminum
127735

127735

4.519 WIDE X 12 FLATBACK W/MOU

Wakefield-Vette
3,628 -

RFQ

127735

Ficha técnica

Box - Active Top Mount, Extrusion Bolt On Rectangular, Fins 12.000 (304.80mm) 4.519 (114.78mm) - 1.898 (48.21mm) - - 0.60°C/W Aluminum
V8818Q

V8818Q

HEATSINK ALUM ANOD

Assmann WSW Components
470 -

RFQ

V8818Q

Ficha técnica

Tray - Active Board Level Bolt On and PC Pin Rectangular, Fins 1.575 (40.00mm) 0.748 (19.00mm) - 0.844 (21.44mm) - - 8.80°C/W Aluminum
322400B00000G

322400B00000G

HEAT SINK TO-18 1W BLK

Aavid, Thermal Division of Boyd Corporation
1,872 -

RFQ

322400B00000G

Ficha técnica

Bag - Active Top Mount Press Fit Cylindrical - - 0.180 (4.57mm) ID, 0.500 (12.70mm) OD 0.235 (5.97mm) 0.6W @ 60°C 30.00°C/W @ 500 LFM 100.00°C/W Aluminum
HSB19-272718

HSB19-272718

HEAT SINK, BGA, 27 X 27 X 18 MM

CUI Devices
239 -

RFQ

HSB19-272718

Ficha técnica

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.709 (18.00mm) 6.8W @ 75°C 4.50°C/W @ 200 LFM 11.11°C/W Aluminum Alloy
667-10ABPPE

667-10ABPPE

HEATSINK TO-220 W/PINS

Wakefield-Vette
419 -

RFQ

667-10ABPPE

Ficha técnica

Bulk 667 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 1.000 (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum
580200B00000G

580200B00000G

HEATSINK 14-16 DIP BLK ANODIZED

Aavid, Thermal Division of Boyd Corporation
373 -

RFQ

580200B00000G

Ficha técnica

Bag - Active Top Mount Press Fit, Slide On Rectangular, Fins 0.890 (22.61mm) 0.600 (15.24mm) - 0.410 (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum
TGH-0130-02

TGH-0130-02

ALUMINIUM HEAT SINK 13X13MM

t-Global Technology
184 -

RFQ

TGH-0130-02

Ficha técnica

Bulk - Active Top Mount - Square, Pin Fins 0.512 (13.00mm) 0.512 (13.00mm) - 0.354 (9.00mm) - - - Aluminum
TGH-0100-01

TGH-0100-01

ALUMINIUM HEAT SINK 10X10MM

t-Global Technology
3,851 -

RFQ

TGH-0100-01

Ficha técnica

Bulk - Active Top Mount - Square, Fins 0.394 (10.00mm) 0.394 (10.00mm) - 0.374 (9.50mm) - - - Aluminum
TGH-0210-01

TGH-0210-01

ALUMINIUM HEAT SINK 25X21MM

t-Global Technology
122 -

RFQ

TGH-0210-01

Ficha técnica

Bulk - Active Top Mount - Rectangular, Fins 0.984 (25.00mm) 0.827 (21.00mm) - 0.138 (3.50mm) - - - Aluminum
634-15ABPE

634-15ABPE

HEATSINK SLIM VERT BLACK TO-220

Wakefield-Vette
3,905 -

RFQ

634-15ABPE

Ficha técnica

Box 634 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 0.640 (16.26mm) - 0.640 (16.26mm) 3.0W @ 50°C 2.00°C/W @ 300 LFM 50.00°C/W Aluminum
TGH-0200-03

TGH-0200-03

ALUMINIUM HEAT SINK 20X20MM

t-Global Technology
282 -

RFQ

TGH-0200-03

Ficha técnica

Bulk - Active Top Mount - Square, Pin Fins 0.787 (20.00mm) 0.787 (20.00mm) - 0.374 (9.50mm) - - - Aluminum
Total 113324 Record«Prev1... 5960616263646566...5667Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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