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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2170488-6HEAT SINK TE Connectivity Raychem Cable Protection |
189 | - |
RFQ |
Tray | XFP | Active | Top Mount | Adhesive | Rectangular, Pin Fins | 2.254 (57.25mm) | 0.709 (18.00mm) | - | 0.500 (12.70mm) | - | - | - | Aluminum | ||
|
TX1822BTHERMAL LINK PRESS ON BLK TO-18 CTS Thermal Management Products |
490 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Top Mount | Stud Mount | Cylindrical | - | 0.380 (9.65mm) | 0.380 (9.65mm) OD | - | - | - | - | Aluminum | |
|
342945COPPER HEATSINK 60X60X14MM Aavid, Thermal Division of Boyd Corporation |
200 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount, Skived | Push Pin | Square, Fins | 2.362 (60.00mm) | 2.362 (60.00mm) | - | 0.551 (14.00mm) | - | 1.70°C/W @ 200 LFM | 7.00°C/W | Copper | |
|
1255509.80WX12 SCR EXTRUSION XX5735 Wakefield-Vette |
2,562 | - |
RFQ |
Ficha técnica |
Box | - | Active | Board Level, Extrusion | Press Fit | Rectangular, Fins | 12.000 (304.80mm) | 9.800 (248.92mm) | - | 2.850 (72.39mm) | - | - | 0.18°C/W | Aluminum | |
|
12768611.420 WIDE X 12 FLATBACK HEAT Wakefield-Vette |
3,265 | - |
RFQ |
Ficha técnica |
Box | - | Active | Top Mount, Extrusion | Adhesive | Rectangular, Fins | 12.000 (304.80mm) | 11.420 (290.07mm) | - | 2.559 (65.00mm) | - | - | 0.19°C/W | Aluminum | |
|
12544910.25WX36 EXTRUSIO 14236 XX5772 Wakefield-Vette |
3,894 | - |
RFQ |
Ficha técnica |
Box | - | Active | Top Mount, Extrusion | Adhesive | Rectangular, Fins | 36.000 (914.40mm) | 10.250 (260.35mm) | - | 2.500 (63.50mm) | - | - | 0.18°C/W | Aluminum | |
|
DV-T268-401E-TRTO-268 SMD HEAT SINK Ohmite |
5,200 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | D | Active | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.220 (30.99mm) | - | 0.460 (11.68mm) | - | - | - | Aluminum | |
|
MPC202025TCERAMIC HEAT SINK - FLAT TYPE AMEC Thermasol |
2,769 | - |
RFQ |
Ficha técnica |
Bulk | MPC | Active | Top Mount | - | Square | 0.787 (20.00mm) | 0.787 (20.00mm) | - | 0.098 (2.50mm) | - | - | - | Ceramic | |
|
SAR55ASX30MMEXTRUDED HEATSINK 55MM X 30MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 55A | Active | Board Level | PC Pin | Rectangular, Fins | 1.181 (30.00mm) | 2.165 (55.00mm) | - | 0.630 (16.00mm) | - | - | - | Aluminum | |
|
|
MPC222225TCERAMIC HEAT SINK - FLAT TYPE AMEC Thermasol |
1,409 | - |
RFQ |
Ficha técnica |
Bulk | MPC | Active | Top Mount | - | Square | 0.866 (22.00mm) | 0.866 (22.00mm) | - | 0.108 (2.75mm) | - | - | - | Ceramic | |
|
SAR255ASX25MMEXTRUDED HEATSINK 255MM X 25MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 255AS | Active | Board Level | PC Pin | Rectangular, Fins | 0.984 (25.00mm) | 10.039 (255.00mm) | - | 0.500 (12.70mm) | - | - | - | Aluminum | |
|
|
SAR255ASX35MMEXTRUDED HEATSINK 255MM X 35MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 255AS | Active | Board Level | PC Pin | Rectangular, Fins | 1.378 (35.00mm) | 10.039 (255.00mm) | - | 0.500 (12.70mm) | - | - | - | Aluminum | |
|
|
SAR55ASX50MMEXTRUDED HEATSINK 55MM X 50MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 55A | Active | Board Level | PC Pin | Rectangular, Fins | 1.969 (50.00mm) | 2.165 (55.00mm) | - | 0.630 (16.00mm) | - | - | - | Aluminum | |
|
SAR110ASX30MMEXTRUDED HEATSINK 78X30MM Sarnikon |
500 | - |
RFQ |
Bulk | 110AS | Active | Top Mount | Thermal Tape, Adhesive | Rectangular, Fins | 1.181 (30.00mm) | 3.071 (78.00mm) | - | 0.787 (20.00mm) | - | - | - | Aluminum | ||
|
SAR155ASX30MMEXTRUDED HEATSINK 155MM X 30MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 155AS | Active | Board Level | PC Pin | Rectangular, Fins | 1.181 (30.00mm) | 6.102 (155.00mm) | - | 1.000 (25.40mm) | - | - | - | Aluminum | |
|
|
MPC303050WTCERAMIC HEAT SINK - WAVE TYPE AMEC Thermasol |
1,050 | - |
RFQ |
Ficha técnica |
Bulk | MPC | Active | Top Mount | - | Square | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.211 (5.37mm) | - | - | - | Ceramic | |
|
|
SAR155ASX35MMEXTRUDED HEATSINK 155MM X 35MM Sarnikon |
500 | - |
RFQ |
Ficha técnica |
Box | 155AS | Active | Board Level | PC Pin | Rectangular, Fins | 1.378 (35.00mm) | 6.102 (155.00mm) | - | 1.000 (25.40mm) | - | - | - | Aluminum | |
|
|
DV-T263-401E-TRTO-263 SMD HEAT SINK Ohmite |
1,800 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | D | Active | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.030 (26.16mm) | - | 0.460 (11.68mm) | - | - | - | Aluminum | |
|
|
SAR110ASX40MMEXTRUDED HEATSINK 78X40MM Sarnikon |
500 | - |
RFQ |
Bulk | 110AS | Active | Top Mount | Thermal Tape, Adhesive | Rectangular, Fins | 1.575 (40.00mm) | 3.071 (78.00mm) | - | 0.787 (20.00mm) | - | - | - | Aluminum | ||
|
CS9461020B*10X10X20MM Cooling Source |
750 | - |
RFQ |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - |
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