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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
625-60ABT4EHEATSINK FOR 25MM BGA Wakefield-Vette |
3,625 | - |
RFQ |
Ficha técnica |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.600 (15.24mm) | - | 8.00°C/W @ 200 LFM | - | Aluminum | |
|
|
625-60ABT5HEATSINK FOR 25MM BGA Wakefield-Vette |
3,669 | - |
RFQ |
Ficha técnica |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.600 (15.24mm) | - | 8.00°C/W @ 200 LFM | - | Aluminum | |
|
|
677-10ABPEHEATSINK Wakefield-Vette |
3,470 | - |
RFQ |
Bulk | 677 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 1.650 (41.91mm) | - | 1.000 (25.40mm) | - | 3.10°C/W @ 200 LFM | - | Aluminum | ||
|
|
677-20ABPHEATSINK MULTIWATT 2.0 BLK Wakefield-Vette |
2,341 | - |
RFQ |
Ficha técnica |
Bulk | 677 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 2.000 (50.80mm) | 1.650 (41.91mm) | - | 1.000 (25.40mm) | 6.0W @ 40°C | 2.50°C/W @ 200 LFM | 6.70°C/W | Aluminum | |
|
|
658-45ABT6HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette |
3,298 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.450 (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Aluminum | |
|
502203B00000HEAT SINK 6W/.75H SPACE SAVER Aavid, Thermal Division of Boyd Corporation |
3,466 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rhombus | 1.630 (41.40mm) | 1.290 (32.77mm) | - | 0.750 (19.05mm) | - | - | - | Aluminum | |
|
HSE-B18508-0396HHEAT SINK, EXTRUSION, TO-218, 50 CUI Devices |
3,435 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 2.000 (50.80mm) | 1.654 (42.00mm) | - | 0.984 (25.00mm) | 12.8W @ 75°C | 2.45°C/W @ 200 LFM | 5.86°C/W | Aluminum Alloy | |
|
|
658-60ABT5HEATSINK EXTRUSION 27MM Wakefield-Vette |
2,778 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.600 (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Aluminum | |
|
TGH-0137-02ALUMINIUM HEAT SINK 25.6X13.7MM t-Global Technology |
3,585 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 1.008 (25.60mm) | 0.539 (13.70mm) | - | 0.472 (12.00mm) | - | - | - | Aluminum | |
|
|
628-20ABT1EHEATSINK FOR 45MM BGA Wakefield-Vette |
3,589 | - |
RFQ |
Ficha técnica |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.200 (5.08mm) | 4.0W @ 80°C | 8.00°C/W @ 300 LFM | - | Aluminum | |
|
|
628-20ABT4EHEATSINK FOR 45MM BGA Wakefield-Vette |
3,191 | - |
RFQ |
Ficha técnica |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.200 (5.08mm) | 4.0W @ 80°C | 8.00°C/W @ 300 LFM | - | Aluminum | |
|
|
628-20ABT5HEATSINK FOR 45MM BGA Wakefield-Vette |
3,187 | - |
RFQ |
Ficha técnica |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.200 (5.08mm) | 4.0W @ 80°C | 8.00°C/W @ 300 LFM | - | Aluminum | |
|
|
DV-T263-301E-TRHEATSINK D2PAK TO-263 DEGREASED Ohmite |
2,363 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | D | Active | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.390 (35.31mm) | - | 0.460 (11.68mm) | 6.0W @ 40°C | 7.00°C/W @ 500 LFM | - | Aluminum | |
|
|
513302B02500GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,254 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 2.500 (63.50mm) | 1.375 (34.93mm) | - | 0.500 (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Aluminum | |
|
|
658-60ABT6HEATSINK EXTRUSION 27MM Wakefield-Vette |
2,182 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.600 (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Aluminum | |
|
|
286-CTEHEATSINK FOR TO220 Wakefield-Vette |
2,145 | - |
RFQ |
Ficha técnica |
Bulk | 286 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.190 (30.23mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 58°C | 7.40°C/W @ 200 LFM | - | Copper | |
|
|
677-25ABPHEATSINK MULTIWATT 2.5 BLK Wakefield-Vette |
2,182 | - |
RFQ |
Ficha técnica |
Bulk | 677 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 2.500 (63.50mm) | 1.650 (41.91mm) | - | 1.000 (25.40mm) | 6.0W @ 35°C | 2.20°C/W @ 200 LFM | - | Aluminum | |
|
|
624-45ABT4EHEATSINK FOR 21MM BGA Wakefield-Vette |
2,474 | - |
RFQ |
Ficha técnica |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.450 (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Aluminum | |
|
|
624-45ABT5HEATSINK FOR 21MM BGA Wakefield-Vette |
3,825 | - |
RFQ |
Ficha técnica |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.450 (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Aluminum | |
|
|
628-25ABT4EHEATSINK FOR 45MM BGA Wakefield-Vette |
3,703 | - |
RFQ |
Ficha técnica |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.250 (6.35mm) | 4.5W @ 80°C | 7.00°C/W @ 300 LFM | - | Aluminum |
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