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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATS-H1-29-C3-R0HEATSINK 70X70X20MM XCUT T412 Advanced Thermal Solutions Inc. |
2,562 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Square, Fins | 2.756 (70.00mm) | 2.756 (70.00mm) | - | 0.790 (20.00mm) | - | 7.61°C/W @ 100 LFM | - | Aluminum | |
|
ATS-H1-34-C3-R0HEATSINK 57.9X36.83X22.86MM T412 Advanced Thermal Solutions Inc. |
2,359 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Rectangular, Fins | 2.280 (57.90mm) | 1.450 (36.83mm) | - | 0.900 (22.86mm) | - | 14.40°C/W @ 100 LFM | - | Aluminum | |
|
HSE11-B20-NPHEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
2,111 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Top Mount | Bolt On | Rectangular | 0.984 (25.00mm) | 0.472 (12.00mm) | - | 0.177 (4.50mm) | 1.93W @ 75°C | 21.40°C/W @ 200 LFM | 38.90°C/W | Aluminum Alloy | |
|
HSS-B20-NP-11HEATSINK TO-220 4.4W ALUMINUM CUI Devices |
3,477 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level | Bolt On | Rectangular, Fins | 0.700 (17.78mm) | 0.779 (19.80mm) | - | 0.850 (21.60mm) | 4.4W @ 75°C | 6.86°C/W @ 200 LFM | 17.05°C/W | Aluminum | |
|
HSS-B20-074HHEATSINK TO-220 3.6W ALUMINUM CUI Devices |
3,050 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.394 (10.00mm) | 0.830 (21.08mm) | - | 0.748 (19.00mm) | 3.6W @ 75°C | 5.39°C/W @ 200 LFM | 20.59°C/W | Aluminum | |
|
240-118ABH-22HEATSINK TO-220 VERT TWIST FIN Wakefield-Vette |
2,822 | - |
RFQ |
Ficha técnica |
Bulk | 240 | Active | Board Level, Vertical | Bolt On and Clip | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 55°C | 5.30°C/W @ 400 LFM | 13.80°C/W | Aluminum | |
|
V2198N1-FHEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components |
2,957 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.394 (10.00mm) | - | - | - | Aluminum Alloy | |
|
|
234-75ABHEATSINK LOW PROFILE Wakefield-Vette |
2,319 | - |
RFQ |
Ficha técnica |
Bulk | 234 | Active | Board Level | Bolt On | Rectangular, Fins | 0.790 (20.07mm) | 0.570 (14.47mm) | - | 0.500 (12.70mm) | 2.0W @ 57°C | 7.50°C/W @ 400 LFM | 28.50°C/W | Aluminum | |
|
|
232-200ABHEATSINK TO-220 VERT Wakefield-Vette |
2,726 | - |
RFQ |
Ficha técnica |
Bulk | 232 | Active | Board Level, Vertical | Clip and PC Pin, Bolt On | Rectangular, Fins | 1.380 (35.05mm) | 0.500 (12.70mm) | - | 2.000 (50.80mm) | 4.0W @ 48°C | 3.30°C/W @ 400 LFM | - | Aluminum | |
|
HSS-C2591-SMT-TRHEAT SINK TO-263 COPPER CUI Devices |
2,670 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | HSS | Active | Top Mount | - | Rectangular, Fins | 0.591 (15.00mm) | 1.020 (25.91mm) | - | 0.375 (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Copper | |
|
|
578405B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,175 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | Press Fit | Rectangular, Fins | 1.000 (25.40mm) | 0.830 (21.08mm) | 0.316 (8.03mm) ID | 0.395 (10.03mm) | 0.6W @ 20°C | 20.00°C/W @ 400 LFM | 31.00°C/W | Aluminum | |
|
ATS-53190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM Advanced Thermal Solutions Inc. |
2,183 | - |
RFQ |
Ficha técnica |
Bulk | maxiGRIP | Active | Top Mount | Clip, Thermal Material | Square, Fins | 0.748 (19.00mm) | 0.748 (19.00mm) | - | 0.768 (19.50mm) | - | 8.40°C/W @ 200 LFM | - | Aluminum | |
|
ATS-H1-38-C3-R0HEATSINK 36.83X57.6X22.86MM T412 Advanced Thermal Solutions Inc. |
3,865 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Rectangular, Fins | 1.450 (36.83mm) | 2.267 (57.60mm) | - | 0.900 (22.86mm) | - | 6.50°C/W @ 100 LFM | - | Aluminum | |
|
ATS-H1-39-C3-R0HEATSINK 57.9X60.96X5.84MM T412 Advanced Thermal Solutions Inc. |
3,799 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Rectangular, Fins | 2.280 (57.90mm) | 2.400 (60.96mm) | - | 0.230 (5.84mm) | - | 18.98°C/W @ 100 LFM | - | Aluminum | |
|
ATS-H1-41-C1-R0HEATSINK 57.9X60.96X17.78MM Advanced Thermal Solutions Inc. |
3,398 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Rectangular, Fins | 2.280 (57.90mm) | 2.400 (60.96mm) | - | 0.700 (17.78mm) | - | 10.02°C/W @ 100 LFM | - | Aluminum | |
|
ATS-61300W-C1-R0MAXIGRIP FANSINK 30X30X24.5MM Advanced Thermal Solutions Inc. |
3,556 | - |
RFQ |
Ficha técnica |
Bulk | fanSINK, maxiGRIP | Discontinued at Mosen | Top Mount | Clip, Thermal Material | Square, Pin Fins | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.965 (24.50mm) | - | 1.70°C/W @ 200 LFM | - | Aluminum | |
|
ATS-H1-40-C3-R0HEATSINK 57.9X60.96X11.43MM T412 Advanced Thermal Solutions Inc. |
3,596 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Rectangular, Fins | 2.280 (57.90mm) | 2.400 (60.96mm) | - | 0.450 (11.43mm) | - | 14.61°C/W @ 100 LFM | - | Aluminum | |
|
ATS-H1-30-C3-R0HEATSINK 70X70X25MM XCUT T412 Advanced Thermal Solutions Inc. |
3,783 | - |
RFQ |
Ficha técnica |
Bulk | pushPIN™ | Active | Top Mount | Push Pin | Square, Fins | 2.756 (70.00mm) | 2.756 (70.00mm) | - | 0.984 (25.00mm) | - | 5.35°C/W @ 100 LFM | - | Aluminum | |
|
|
HSET875-X-1HEAT SPREADER FOR ET875-X7/ X5 iBASE Technology |
2,071 | - |
RFQ |
Box | - | Active | ET875-x7/x5Q/x5 | - | - | - | - | - | - | - | - | - | |||
|
|
HSIBQ800-1HEAT SPREADER FOR IBQ800 (H051HS iBASE Technology |
3,686 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - |
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