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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
513201B02500G HEATSINK TO-218/TO-247 W/PINS 2 Aavid, Thermal Division of Boyd Corporation	7,988	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	2.000 (50.80mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	2.0W @ 20°C	3.00°C/W @ 400 LFM	8.30°C/W	Aluminum
7139DG HEATSINK TO-220 TIN CLIP-ON 13MM Aavid, Thermal Division of Boyd Corporation	4,924	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level	Clip and PC Pin	Rectangular, Fins	0.780 (19.81mm)	0.520 (13.21mm)	-	0.515 (13.08mm)	1.5W @ 50°C	8.00°C/W @ 500 LFM	28.30°C/W	Copper
6025DG HEATSINK TO-220 STAGGEREDFIN TIN Aavid, Thermal Division of Boyd Corporation	30,101	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.250 (31.75mm)	0.875 (22.23mm)	-	0.250 (6.35mm)	3.0W @ 60°C	7.00°C/W @ 400 LFM	17.90°C/W	Copper
6236BG HEATSINK TO-220 CLIP-ON BLACK Aavid, Thermal Division of Boyd Corporation	4,953	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Clip	Rectangular, Fins	0.700 (17.78mm)	0.520 (13.21mm)	-	0.510 (12.95mm)	2.0W @ 50°C	12.00°C/W @ 300 LFM	25.00°C/W	Aluminum
7109DG TOP MOUNT HEATSINK .45 D2PAK Aavid, Thermal Division of Boyd Corporation	11,234	-	RFQ	Ficha técnica	Bag	-	Active	Top Mount	SMD Pad	Rectangular, Fins	0.763 (19.38mm)	1.000 (25.40mm)	-	0.450 (11.43mm)	2.0W @ 30°C	3.00°C/W @ 300 LFM	11.00°C/W	Copper
LTN20069 HEAT SINK BGA/PGA 16.5X16.5X8.9 Wakefield-Vette	2,502	-	RFQ	Ficha técnica	Bulk	Penguin	Active	Board Level	Thermal Tape, Adhesive (Included)	Square, Fins	0.650 (16.51mm)	0.653 (16.59mm)	-	0.350 (8.89mm)	-	8.00°C/W @ 500 LFM	-	Aluminum
581002B02500G HEATSINK TO-220 PWR BLK W/PINS Aavid, Thermal Division of Boyd Corporation	9,706	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	0.640 (16.26mm)	-	0.640 (16.26mm)	2.5W @ 50°C	4.00°C/W @ 500 LFM	17.40°C/W	Aluminum
637-10ABPE HEATSINK TO-220 VERT MT BLK 1 Wakefield-Vette	5,128	-	RFQ	Ficha técnica	Box	637	Active	Board Level, Vertical	Bolt On and Board Mounts	Rectangular, Fins	1.000 (25.40mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	6.0W @ 76°C	5.80°C/W @ 200 LFM	-	Aluminum
531002B02500G HEATSINK TO-220 W/PINS 1 TALL Aavid, Thermal Division of Boyd Corporation	10,943	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	2.0W @ 30°C	4.00°C/W @ 400 LFM	13.40°C/W	Aluminum
7109D/TRG HEATSINK TO-263 (D2PK) Aavid, Thermal Division of Boyd Corporation	16,758	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	Top Mount	SMD Pad	Rectangular, Fins	0.763 (19.38mm)	1.000 (25.40mm)	-	0.450 (11.43mm)	2.0W @ 30°C	3.00°C/W @ 300 LFM	11.00°C/W	Copper
DV-T263-101E-TR TO-263 HEAT SINK / POLY TAPE Ohmite	2,397	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	D	Active	Top Mount	Solderable Feet	Rectangular, Fins	0.500 (12.70mm)	1.020 (25.91mm)	-	0.400 (10.16mm)	2.0W @ 30°C	8.00°C/W @ 500 LFM	-	Aluminum
7023B-MTG BOARD LEVEL HEATSINK 1.95 TO220 Aavid, Thermal Division of Boyd Corporation	9,533	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.950 (49.53mm)	1.900 (48.26mm)	-	0.950 (24.13mm)	3.0W @ 20°C	2.50°C/W @ 400 LFM	4.40°C/W	Aluminum
534202B02853G HEATSINK TO-220 W/SHURLOCK-CLIP Aavid, Thermal Division of Boyd Corporation	8,148	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Clip and Board Locks	Rectangular, Fins	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	13.40°C/W	Aluminum
529802B02500G HEATSINK TO-220 W/PINS 1.5TALL Aavid, Thermal Division of Boyd Corporation	569	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.650 (41.91mm)	-	1.500 (38.10mm)	10.0W @ 50°C	3.00°C/W @ 200 LFM	3.70°C/W	Aluminum
7106DG BOARD LEVEL HEATSINK .375 D2PAK Aavid, Thermal Division of Boyd Corporation	13,123	-	RFQ	Ficha técnica	Bulk	-	Active	Top Mount	SMD Pad	Rectangular, Fins	0.591 (15.00mm)	1.020 (25.91mm)	-	0.375 (9.52mm)	2.0W @ 40°C	5.00°C/W @ 400 LFM	-	Copper
529702B02500G BOARD LEVEL HEATSINK 1 TO-220 Aavid, Thermal Division of Boyd Corporation	4,428	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.650 (41.91mm)	-	1.000 (25.40mm)	4.0W @ 30°C	4.00°C/W @ 200 LFM	5.50°C/W	Aluminum
6396BG HEATSINK TO-218/TO-220 PIN Aavid, Thermal Division of Boyd Corporation	11,055	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.650 (41.91mm)	-	1.000 (25.40mm)	4.0W @ 30°C	1.50°C/W @ 600 LFM	5.60°C/W	Aluminum
6043BG HEATSINK TO-220 LOCKING TAB CLIP Aavid, Thermal Division of Boyd Corporation	12,985	-	RFQ	Ficha técnica	Bulk	-	Active	Board Level	Clip	Rectangular	0.800 (20.32mm)	0.268 (6.81mm)	-	1.000 (25.40mm)	1.5W @ 40°C	4.00°C/W @ 500 LFM	23.00°C/W	Aluminum
573100D00000G TOP MOUNT HEATSINK .4 D-PAK Aavid, Thermal Division of Boyd Corporation	7,371	-	RFQ	Ficha técnica	Bulk	5731	Active	Top Mount	SMD Pad	Rectangular, Fins	0.315 (8.00mm)	0.900 (22.86mm)	-	0.400 (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	15.00°C/W	Aluminum
624-25ABT4E HEATSINK CPU 21MM SQ W/DBL TAPE Wakefield-Vette	7,158	-	RFQ	Ficha técnica	Bulk	624	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827 (21.00mm)	0.827 (21.00mm)	-	0.250 (6.35mm)	-	25.00°C/W @ 200 LFM	-	Aluminum