Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
901-19-1-23-2-B-0

901-19-1-23-2-B-0

HEATSINK 19X19X23MM ELLIPTICAL

Wakefield-Vette
263 -

RFQ

901-19-1-23-2-B-0

Ficha técnica

Box 901 Active Top Mount Push Pin Square, Pin Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.892 (22.65mm) - 4.90°C/W @ 200 LFM 12.00°C/W Aluminum
374724B60024G

374724B60024G

HEATSINK BGA W/O SOLDER ANCHORS

Aavid, Thermal Division of Boyd Corporation
1,134 -

RFQ

374724B60024G

Ficha técnica

Bulk - Active Top Mount Solder Anchor Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.709 (18.00mm) 3.0W @ 50°C 5.20°C/W @ 200 LFM 15.30°C/W Aluminum
ATS-06C-152-C2-R0

ATS-06C-152-C2-R0

HEATSINK 35X35X35MM L-TAB T766

Advanced Thermal Solutions Inc.
125 -

RFQ

ATS-06C-152-C2-R0

Ficha técnica

Tray pushPIN™ Active Top Mount Push Pin Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 1.378 (35.00mm) - 3.32°C/W @ 100 LFM - Aluminum
CR301-75AE

CR301-75AE

ALUMINUM HEATSINK 75MM BLK ANODI

Ohmite
232 -

RFQ

CR301-75AE

Ficha técnica

Box CR Active Board Level, Vertical 2 Clips and PC Pin Rectangular, Fins 2.953 (75.00mm) 2.362 (60.00mm) - - - - 4.50°C/W Aluminum Alloy
CE-OMNI-38

CE-OMNI-38

HEATSINK CER TO-220 TO-247

Wakefield-Vette
380 -

RFQ

CE-OMNI-38

Ficha técnica

Tray - Active Board Level, Vertical Solderable Feet Rectangular, Fins 0.803 (20.40mm) 1.339 (34.00mm) - 1.512 (38.40mm) - 3.80°C/W @ 200 LFM 7.00°C/W Ceramic
OMNI-UNI-40-50-D

OMNI-UNI-40-50-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
282 -

RFQ

OMNI-UNI-40-50-D

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 1.969 (50.00mm) 1.575 (40.00mm) - 2.953 (75.00mm) - - - Aluminum
PF750G

PF750G

HTSK-AL-PF750 REV A-G

Aavid, Thermal Division of Boyd Corporation
703 -

RFQ

PF750G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular 0.866 (22.00mm) 0.433 (11.00mm) - 0.748 (19.00mm) - - - Aluminum
6221BG

6221BG

THM,16555B REV D-G

Aavid, Thermal Division of Boyd Corporation
2,560 -

RFQ

6221BG

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) - - - Aluminum
PV-T21-38E

PV-T21-38E

DUAL PIN FIN HEATSINK 1 CLIP

Ohmite
110 -

RFQ

PV-T21-38E

Ficha técnica

Box P Active Board Level, Vertical Clip and PC Pin Rectangular, Pin Fins 2.170 (55.12mm) 1.240 (31.50mm) - 1.520 (38.61mm) - - 3.89°C/W Aluminum
BGAH150-125E

BGAH150-125E

BGA HEATSINK W/TAPE

Ohmite
167 -

RFQ

BGAH150-125E

Ficha técnica

Box BG Active Top Mount Thermal Tape, Adhesive (Included) Square, Angled Fins 0.591 (15.00mm) 0.591 (15.00mm) - 0.492 (12.50mm) - - 10.30°C/W Aluminum Alloy
609-50ABS3

609-50ABS3

HEATSINK FOR POWERPC CPU BLK

Wakefield-Vette
464 -

RFQ

609-50ABS3

Ficha técnica

Bulk 609 Active Top Mount Clip, Thermal Material Rectangular, Pin Fins 2.895 (73.53mm) 2.000 (50.80mm) - 0.500 (12.70mm) - 2.50°C/W @ 250 LFM - Aluminum
C220-075-3VE

C220-075-3VE

HEATSINK AND CLIPS FOR 3 TO-220

Ohmite
116 -

RFQ

C220-075-3VE

Ficha técnica

Box C Active Board Level, Vertical 3 Clips and PC Pin Rectangular, Fins 2.953 (75.00mm) 1.500 (38.10mm) - 0.710 (18.03mm) - - - Aluminum
ATS-21D-20-C2-R0

ATS-21D-20-C2-R0

HEATSINK 54X54X25MM XCUT T766

Advanced Thermal Solutions Inc.
139 -

RFQ

ATS-21D-20-C2-R0

Ficha técnica

Tray pushPIN™ Active Top Mount Push Pin Square, Fins 2.126 (54.00mm) 2.126 (54.00mm) - 0.984 (25.00mm) - 7.14°C/W @ 100 LFM - Aluminum
904-27-2-23-2-B-0

904-27-2-23-2-B-0

HEATSINK 27X27X23MM PIN

Wakefield-Vette
1,181 -

RFQ

904-27-2-23-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.892 (22.65mm) - 3.20°C/W @ 200 LFM 10.60°C/W Aluminum
904-27-1-23-2-B-0

904-27-1-23-2-B-0

HEATSINK 27X27X23MM ELLIPTICAL

Wakefield-Vette
117 -

RFQ

904-27-1-23-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.892 (22.65mm) - 3.50°C/W @ 200 LFM 9.40°C/W Aluminum
500403B00000G

500403B00000G

HEATSINK TO-3 12W H=1.25 BLK

Aavid, Thermal Division of Boyd Corporation
2,374 -

RFQ

500403B00000G

Ficha técnica

Bag - Active Board Level Bolt On Square, Pin Fins 1.810 (45.97mm) 1.810 (45.97mm) - 1.250 (31.75mm) 10.0W @ 50°C 2.00°C/W @ 400 LFM 5.00°C/W Aluminum
908-35-1-12-2-B-0

908-35-1-12-2-B-0

HEATSINK 35X35X12MM ELLIPTICAL

Wakefield-Vette
404 -

RFQ

908-35-1-12-2-B-0

Ficha técnica

Box 908 Active Top Mount Push Pin Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.457 (11.60mm) - 3.10°C/W @ 200 LFM 11.10°C/W Aluminum
C220-075-3AE

C220-075-3AE

HEATSINK AND CLIPS FOR 3 TO-220

Ohmite
520 -

RFQ

C220-075-3AE

Ficha técnica

Box C Active Board Level, Vertical 3 Clips and PC Pin Rectangular, Fins 2.953 (75.00mm) 1.500 (38.10mm) - 0.710 (18.03mm) - - - Aluminum
ATS-55325D-C1-R0

ATS-55325D-C1-R0

HEAT SINK 32.5 X 32.5 X 9.5MM

Advanced Thermal Solutions Inc.
381 -

RFQ

ATS-55325D-C1-R0

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.280 (32.51mm) 1.280 (32.51mm) - 0.374 (9.50mm) - 12.50°C/W @ 200 LFM - Aluminum
530402B00150G

530402B00150G

HEAT SINK 1.75 HIGH RISE TO-220

Aavid, Thermal Division of Boyd Corporation
1,303 -

RFQ

530402B00150G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and Board Mounts Rectangular, Fins 1.750 (44.45mm) 0.750 (19.05mm) - 1.750 (44.45mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.30°C/W Aluminum
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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