Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
7141DG

7141DG

BOARD LEVEL HEATSINK .515TO-220

Aavid, Thermal Division of Boyd Corporation
1,929 -

RFQ

7141DG

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.780 (19.81mm) 0.520 (13.21mm) - 0.515 (13.08mm) 1.0W @ 30°C 10.00°C/W @ 200 LFM 20.30°C/W Copper
M46165B021000G

M46165B021000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation
646 -

RFQ

M46165B021000G

Ficha técnica

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.620 (41.15mm) 1.181 (30.00mm) - 1.909 (48.50mm) - - - Aluminum
M45165B021000G

M45165B021000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation
473 -

RFQ

M45165B021000G

Ficha técnica

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.650 (41.91mm) 1.181 (30.00mm) - 1.988 (50.50mm) - - - Aluminum
533402B02552G

533402B02552G

HEATSINK TO-220 SOLDERPIN/CLIP

Aavid, Thermal Division of Boyd Corporation
1,436 -

RFQ

533402B02552G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.650 (41.91mm) 1.000 (25.40mm) - 1.500 (38.10mm) 8.0W @ 40°C 2.00°C/W @ 500 LFM 5.00°C/W Aluminum
7136DG

7136DG

BOARD LEVEL HEATSINK .515TO-220

Aavid, Thermal Division of Boyd Corporation
2,830 -

RFQ

7136DG

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.848 (21.55mm) 0.520 (13.21mm) - 0.515 (13.08mm) 1.0W @ 30°C 6.00°C/W @ 500 LFM 19.70°C/W Copper
326005B00000G

326005B00000G

HEATSINK TO-5 1W H=.375 BLK

Aavid, Thermal Division of Boyd Corporation
728 -

RFQ

326005B00000G

Ficha técnica

Bag - Active Board Level Press Fit Cylindrical - - 0.318 (8.07mm) ID, 0.500 (12.70mm) OD 0.375 (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Aluminum
578305B00000G

578305B00000G

HEATSINK TO-5 .75 BLACK

Aavid, Thermal Division of Boyd Corporation
1,026 -

RFQ

578305B00000G

Ficha técnica

Bag - Active Top Mount Press Fit Rectangular, Fins 0.750 (19.05mm) 0.830 (21.08mm) 0.316 (8.03mm) ID 0.395 (10.03mm) 1.0W @ 30°C 20.00°C/W @ 300 LFM 35.00°C/W Aluminum
551002B00000G

551002B00000G

HEATSINK TO-220 1.45 HIGH

Aavid, Thermal Division of Boyd Corporation
582 -

RFQ

551002B00000G

Ficha técnica

Bag - Active Board Level Bolt On Rectangular, Fins 1.450 (36.83mm) 1.006 (25.55mm) - 0.787 (19.99mm) 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.40°C/W Aluminum
7024B-MTG

7024B-MTG

HEATSINK TO-220 TAB FOLD 41.15MM

Aavid, Thermal Division of Boyd Corporation
7,956 -

RFQ

7024B-MTG

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.620 (41.15mm) 2.000 (50.80mm) - 0.750 (19.05mm) 9.0W @ 60°C 4.00°C/W @ 200 LFM 5.60°C/W Aluminum
323005B00000G

323005B00000G

HEATSINK TO-5 2W BLK

Aavid, Thermal Division of Boyd Corporation
144 -

RFQ

323005B00000G

Ficha técnica

Bag - Active Board Level Press Fit Cylindrical - - 0.318 (8.07mm) ID, 0.750 (19.05mm) OD 0.250 (6.35mm) 1.4W @ 70°C 35.00°C/W @ 200 LFM 56.00°C/W Aluminum
563002B00000G

563002B00000G

HEATSINK TO-220 VERT MNT 1.18

Aavid, Thermal Division of Boyd Corporation
3,139 -

RFQ

563002B00000G

Ficha técnica

Bag - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 1.0W @ 20°C 7.00°C/W @ 200 LFM 13.00°C/W Aluminum
374324B60023G

374324B60023G

BGA HEAT SINK

Aavid, Thermal Division of Boyd Corporation
4,302 -

RFQ

374324B60023G

Ficha técnica

Bulk 37432 Active Board Level Solder Anchor Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.394 (10.00mm) 1.5W @ 50°C 6.00°C/W @ 500 LFM 30.60°C/W Aluminum
374724B00032G

374724B00032G

HEATSINK BGA W/ADHESIVE TAPE

Aavid, Thermal Division of Boyd Corporation
2,177 -

RFQ

374724B00032G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.709 (18.00mm) 3.0W @ 50°C 5.20°C/W @ 200 LFM 15.30°C/W Aluminum
374624B00032G

374624B00032G

HEATSINK BGA 35X35X10MM W/ADH

Aavid, Thermal Division of Boyd Corporation
1,136 -

RFQ

374624B00032G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.394 (10.00mm) 1.5W @ 40°C 7.60°C/W @ 200 LFM 23.40°C/W Aluminum
6030B-TTG

6030B-TTG

THM,10594B-TT REV BB(COPPER)G

Aavid, Thermal Division of Boyd Corporation
626 -

RFQ

6030B-TTG

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) - - - Copper
533422B02552G

533422B02552G

HEATSINK TO-220 SOLDERPIN/CLIP

Aavid, Thermal Division of Boyd Corporation
2,357 -

RFQ

533422B02552G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.650 (41.91mm) 1.000 (25.40mm) - 1.500 (38.10mm) 10.0W @ 50°C 3.00°C/W @ 200 LFM - Aluminum
501303B00000G

501303B00000G

HEAT SINK TO-3 .500 COMPACT

Aavid, Thermal Division of Boyd Corporation
913 -

RFQ

501303B00000G

Ficha técnica

Bag - Active Board Level Bolt On Rhombus 1.880 (47.75mm) 1.400 (35.56mm) - 0.500 (12.70mm) 2.0W @ 30°C 4.00°C/W @ 300 LFM 12.00°C/W Aluminum
7023BG

7023BG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,853 -

RFQ

7023BG

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.950 (49.53mm) 1.900 (48.26mm) - 0.950 (24.13mm) 5.0W @ 30°C 2.50°C/W @ 400 LFM 4.40°C/W Aluminum
7128DG

7128DG

BOARD LEVEL HEATSINK .375TO-220

Aavid, Thermal Division of Boyd Corporation
3,548 -

RFQ

7128DG

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.100 (27.94mm) 0.866 (22.00mm) - 0.375 (9.52mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 19.20°C/W Copper
6238B-MTG

6238B-MTG

BOARD LEVEL HEATSINK .61 TO-220

Aavid, Thermal Division of Boyd Corporation
1,936 -

RFQ

6238B-MTG

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.159 (29.44mm) 1.005 (25.53mm) - 0.610 (15.49mm) 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Aluminum
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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