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Térmico - Adhesivos, epoxis, grasas, pastas

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	Size/Dimension	UsableTemperatureRange	Color	ThermalConductivity	Features	ShelfLife
8349TFM-25ML THERMAL ADHESIVE 25ML MG Chemicals	3,608	-	RFQ	Ficha técnica	Bulk	-	Active	Epoxy, 2 Part	25 ml Syringe	-67°F ~ 329°F (-50°C ~ 165°C)	White	1.10W/m-K	-	36 Months
65-00-TC50-0010 THERM-A-GAP TC50 5.2W/M-K 10CC Parker Chomerics	3,505	-	RFQ	Ficha técnica	Bulk	THERM-A-GAP™ TC50	Active	Silicone Putty	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	Gray	5.00W/m-K	Low Outgassing (ASTM E595)	18 Months
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	2,933	-	RFQ	Ficha técnica	Bulk	8329TFS	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months
A17170-01 TPUTTY 508 Laird Technologies - Thermal Materials	2,396	-	RFQ	Ficha técnica	Box	Tputty™ 508	Active	Silicone Compound	75cc Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Green	3.70W/m-K	Low Outgassing (ASTM E595)	6 Months
1379310 CATALYST 9 (27G) LOCTITE	3,055	-	RFQ		Bulk	STYCAST™ 2651™	Active	Catalyst	-	-40°F ~ 266°F (-40°C ~ 130°C)	Black	-	-	18 Months
65-02-GEL75-0030 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	2,717	-	RFQ	Ficha técnica	Bottle	THERM-A-GAP™ GEL 75	Active	Silicone Gel	30cc Syringe	-40°F ~ 392°F (-40°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	9 Months
TG-NSP25-60 SILICONE FREE THERMAL PUTTY 60CC t-Global Technology	2,223	-	RFQ	Ficha técnica	Box	TG	Active	Non-Silicone Putty	60cc Container	-58°F ~ 302°F (-50°C ~ 150°C)	Gray	2.50W/m-K	-	24 Months
1978-1 SILICONE FREE HEAT SINK Techspray	3,311	-	RFQ	Ficha técnica	Bulk	-	Active	Non-Silicone Compound	1 lb Can	-	Gray	-	-	60 Months
832TC-450ML THERMALLY CONDUCTIVE EPOXY MG Chemicals	3,400	-	RFQ	Ficha técnica	Box	832TC	Active	Epoxy, 2 Part	450 ml Kit	-22°F ~ 347°F (-30°C ~ 175°C)	Black	0.68W/m-K	-	60 Months
65-00-T670-0080 T670 3W/M-K GREASE 80CC JAR Parker Chomerics	3,940	-	RFQ	Ficha técnica	Bulk	-	Active	Silicone Grease	227 grams	-58°F ~ 392°F (-50°C ~ 200°C)	White	3.00W/m-K	-	24 Months
TG-N909-1000 NON-SILICONE THERMAL GREASE 1KG t-Global Technology	2,526	-	RFQ	Ficha técnica	Bulk	TG-N909	Active	Non-Silicone Grease	1 kg Container	-40°F ~ 392°F (-40°C ~ 200°C)	Gray	9.00W/m-K	Low Outgassing (ASTM E595)	18 Months
1586134 ECCOBOND 56C-CAT 9 KIT, 140.5GM LOCTITE	3,883	-	RFQ	Ficha técnica	Bulk	-	Active	Epoxy, 2 Part	140.5 grams	-76°F ~ 248°F (-60°C ~ 120°C)	Silver	3.00W/m-K	Low Outgassing (ASTM E595)	12 Months
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	102	-	RFQ	Ficha técnica	Bulk	CHIPQUIK®	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months
65-00-T630-0300 THERM-A-GAP T630 0.7W/M-K 300CC Parker Chomerics	3,583	-	RFQ	Ficha técnica	Bulk	THERM-A-GAP™ GEL T630	Active	Gel Gap Filler	300cc Cartridge	-67°F ~ 392°F (-55°C ~ 200°C)	White	0.70W/m-K	-	18 Months
P0200-19 HEAT SINK COMP. SARAN PKG 2GR Littelfuse Inc.	3,157	-	RFQ	Ficha técnica	Bulk	P0200	Active	Non-Silicone Compound	2 gram Package	-	-	-	-	12 Months
HSC67-6G SILICONE HEAT SINK COMPOUND SQUE CAIG Laboratories, Inc.	2,405	-	RFQ	Ficha técnica	Bulk	-	Active	Silicone Compound	6 gram Tube	-	-	0.67W/m-K	-	60 Months
TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	2,683	-	RFQ	Ficha técnica	Bulk	CHIPQUIK®	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months
TC1-10G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	3,397	-	RFQ	Ficha técnica	Bulk	-	Active	Silicone Compound	10 gram Syringe	-	White	0.67W/m-K	-	60 Months
BT-102-50M TOUGHENED, FLEXIBLE ADHESIVE SYS Wakefield-Vette	3,016	-	RFQ	Ficha técnica	Bulk	BondaTherm™	Active	Epoxy, 2 Part	50 ml Cartridges	-	-	-	-	12 Months
BT-101-50M NON-SAG 5 MINUTE BONDATHERM EPOX Wakefield-Vette	3,970	-	RFQ	Ficha técnica	Bulk	BondaTherm™	Active	Epoxy, 2 Part	50 ml Cartridges	-58°F ~ 266°F (-50°C ~ 130°C)	Clear	-	-	12 Months