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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
44-7340-0000SOLDER BAR E-BAR 1.66LB Kester Solder |
240 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Bar Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | - | 565 ~ 574°F (296 ~ 301°C) | - | - | - | Leaded | Bar, 1.66 lbs (750g) | - | - |
|
JPAGSC1501PSIL CAN 15 BRAZING ALLOY Canfield Technologies |
3,513 | - |
RFQ |
Ficha técnica |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - |
|
SMDIN52SN48INDIUM SOLDER WIRE (IN52/SN48) 0 Chip Quik Inc. |
3,754 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | In52Sn48 (52/48) | 0.031 (0.79mm) | 244°F (118°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | - | - |
|
SMDSWLF.020 4OZSLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc. |
3,485 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLTLFP32SOLDER WIRE LOW TEMP 42/57/1 32' Chip Quik Inc. |
3,975 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.030 (0.76mm) | 281°F (138°C) | - | 21 AWG, 22 SWG | - | Lead Free | - | - | - |
|
RASW.031 .7OZSOLDER WIRE POCKET PACK 63/37 TI Chip Quik Inc. |
2,477 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - |
|
RASW.031 1OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,783 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
4880-18GSOLDER RA 63/37 .032 PKT PACK MG Chemicals |
2,132 | - |
RFQ |
Ficha técnica |
Bulk | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Tube, 0.63 oz (18g) | 60 Months | - |
|
4860-18GSOLDER NO-CLEAN 63/37 POCKET PK MG Chemicals |
2,310 | - |
RFQ |
Ficha técnica |
Bulk | 4860 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.63 oz (18g) | 60 Months | - |
|
SMD2SW.031 1OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,649 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.031 2OZSOLDER WIRE NO-CLEAN 63/37 2OZ. Chip Quik Inc. |
2,311 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
NC191AX15SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,629 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMDSWLF.020 1OZSLD WIRE NO-CLEAN 96.5/3/.5 1OZ. Chip Quik Inc. |
2,634 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
NC191SNL15SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,940 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
WBWS633731-4OZSOLDER NO-CLEAN 63/37 .031 4 OZ SRA Soldering Products |
2,682 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | - | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
T0051403099WSW SNPB L1, 1,0MM, 100G Apex Tool Group |
3,694 | - |
RFQ |
Ficha técnica |
Spool | Weller® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.039 (0.99mm) | - | No-Clean | - | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMDSWLF.006 1GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
3,144 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.035 oz (1g) | - | - |
|
NC191AX50SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
2,730 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD2SW.015 100GSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,579 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMD2SW.031 4OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,679 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
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