+86 075582561136
Subir BOM
Soldadura
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
981501SAC305 BAR SOLDR 2.5LB +/- 0.2LB Multicore |
3,160 | - |
RFQ |
Ficha técnica |
Bar | - | Obsolete | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | - | - | - | Lead Free | Bar, 2.5 lbs (1.13kg) | - | - |
|
68029099C BAR SOLDER 2LB +/- 0.2LB Multicore |
2,652 | - |
RFQ |
Ficha técnica |
Bar | - | Obsolete | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 440 ~ 464°F (227 ~ 240°C) | - | - | - | Lead Free | Bar, 2.5 lbs (1.13kg) | - | - |
|
55488963/37 BAR SLDR 2LB +/- 0.2LB BAR Multicore |
3,781 | - |
RFQ |
Ficha técnica |
Bar | - | Obsolete | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 2 lbs (907g) | - | - |
|
58348963/37 MP200 SOLDER FLUX 25GM Multicore |
2,947 | - |
RFQ |
Ficha técnica |
Cartridge | MP200 | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | - | Leaded | Cartridge, 0.88 oz (25g) | 6 Months | Date of Manufacture |
|
4866-227GSOLDER 63/37 NOCLEAN .04DIA .5LB MG Chemicals |
3,394 | - |
RFQ |
Ficha técnica |
Spool | 4860 | Obsolete | Wire Solder | Sn63Pb37 (63/37) | 0.040 (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
4867-227GSOLDER 63/37 NOCLEAN .05DIA .5LB MG Chemicals |
2,127 | - |
RFQ |
Ficha técnica |
Spool | 4860 | Obsolete | Wire Solder | Sn63Pb37 (63/37) | 0.050 (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
4876-227GSOLDER 60/40 NOCLEAN .04DIA .5LB MG Chemicals |
2,455 | - |
RFQ |
Ficha técnica |
Spool | 4870 | Obsolete | Wire Solder | Sn60Pb40 (60/40) | 0.040 (1.02mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 18 AWG, 19 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
4877-227GSOLDER 60/40 NOCLEAN .05DIA .5LB MG Chemicals |
3,894 | - |
RFQ |
Ficha técnica |
Spool | 4870 | Obsolete | Wire Solder | Sn60Pb40 (60/40) | 0.050 (1.27mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
1769646SOLDER PASTE HF 212 - 500GRAM JA Multicore |
2,103 | - |
RFQ |
Ficha técnica |
Bulk | HF212 | Obsolete | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
1769647SOLDER PASTE HF 212 - 600GRAM JA Multicore |
2,833 | - |
RFQ |
Ficha técnica |
Bulk | HF212 | Obsolete | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | Jar, 21.16 oz (600g) | 6 Months | Date of Manufacture |
|
|
104210060/40C511 3C 1.63MM AF 2.5KG AM Multicore |
3,857 | - |
RFQ |
Ficha técnica |
Bulk | C511™ | Active | Wire Solder | Sn60Pb40 (60/40) | 0.064 (1.63mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 5.51 lbs (2.5kg) | - | - |
|
|
437756SAV1 366 5C 0.81MM 0.5KG AM Multicore |
2,785 | - |
RFQ |
Ficha técnica |
Bulk | 366 | Obsolete | Wire Solder | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | 0.032 (0.81mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
|
568759SAV1 366 5C 1.22MM 0.5KG AM Multicore |
2,356 | - |
RFQ |
Ficha técnica |
Bulk | 366 | Obsolete | Wire Solder | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | 0.048 (1.22mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
|
73301096SC C511 3C 0.81MM 0.5KG .032 Multicore |
3,426 | - |
RFQ |
Ficha técnica |
Bulk | C511™ | Obsolete | Wire Solder | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 0.032 (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
|
81800663/37 C400 5C 0.71MM 0.5KG AM Multicore |
2,060 | - |
RFQ |
Ficha técnica |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.028 (0.71mm) | 361°F (183°C) | No-Clean | 21 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
84932897SC C502 3C 1.63MM 2.5KG AM Multicore |
2,021 | - |
RFQ |
Ficha técnica |
Bulk | C502 | Obsolete | Wire Solder | - | 0.064 (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | - | Spool, 5.51 lbs (2.5kg) | - | - |
|
|
135429663S4 WS200 ACP PASTE 600G SEMCO Multicore |
3,924 | - |
RFQ |
Ficha técnica |
Bulk | WS200™ | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture |
|
|
135429863S4 WS200 ACP 500G JAR Multicore |
3,560 | - |
RFQ |
Ficha técnica |
Bulk | WS200™ | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
|
137124597SC LF620 DAP89V Multicore |
2,025 | - |
RFQ |
Ficha técnica |
Bulk | LF620M | Obsolete | Solder Paste | - | - | - | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | - | - |
|
|
137242597SCL F620 DAP89V Multicore |
3,447 | - |
RFQ |
Ficha técnica |
Bulk | LF620M | Obsolete | Solder Paste | - | - | - | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | - | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
