Soldadura

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
397952

397952

HMP 366 3% .022DIA. 23AWG

Multicore
3,675 -

RFQ

397952

Ficha técnica

Bulk 366 Active Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 0.022 (0.56mm) 565 ~ 574°F (296 ~ 301°C) Rosin Activated (RA) 23 AWG, 24 SWG - Leaded Spool, 8.8 oz (250g) - -
386820

386820

63/37 HYDRO-X 2% .022DIA 23AWG

Multicore
2,528 -

RFQ

386820

Ficha técnica

Bulk Hydro-X Active Wire Solder Sn63Pb37 (63/37) 0.022 (0.56mm) 361°F (183°C) Water Soluble 23 AWG, 24 SWG - Leaded Spool, 8.8 oz (250g) - -
386844

386844

63/37 400 2% .015DIA 27AWG

Multicore
3,542 -

RFQ

386844

Ficha técnica

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.015 (0.38mm) 361°F (183°C) No-Clean 27 AWG, 28 SWG - Leaded Spool, 8.8 oz (250g) - -
395451

395451

63/37 CRYSL 502 3% .032DIA 20AWG

Multicore
3,991 -

RFQ

395451

Ficha técnica

Bulk C502 Active Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - -
395467

395467

60/40 370 5C 1.22MM 0.5KG AM

Multicore
2,644 -

RFQ

395467

Ficha técnica

Bulk 370 Active Wire Solder Sn60Pb40 (60/40) 0.048 (1.22mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 16 AWG, 18 SWG - Leaded Spool, 17.64 oz (500g) - -
386851

386851

63/37 CRYSL 502 2% .022DIA 23AWG

Multicore
3,731 -

RFQ

386851

Ficha técnica

Bulk C502 Active Wire Solder Sn63Pb37 (63/37) 0.022 (0.56mm) 361°F (183°C) No-Clean 23 AWG, 24 SWG - Leaded Spool, 1 lb (454 g) - -
386818

386818

63/37 HYDRO-X 2% .032DIA 20AWG

Multicore
3,321 -

RFQ

386818

Ficha técnica

Bulk Hydro-X Active Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) Water Soluble 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - -
386927

386927

63/37 400 2% .032DIA 20AWG

Multicore
3,412 -

RFQ

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - -
392249

392249

63/37 400 2% .064DIA 14AWG

Multicore
3,098 -

RFQ

392249

Ficha técnica

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.064 (1.63mm) 361°F (183°C) No-Clean 14 AWG, 16 SWG - Leaded Spool, 1 lb (454 g) - -
673828

673828

97SC 400 2% .022DIA 23AWG

Multicore
3,254 -

RFQ

673828

Ficha técnica

Bulk C400 Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.022 (0.56mm) 423°F (217°C) No-Clean 23 AWG, 24 SWG - Lead Free Spool, 8.8 oz (250g) - -
386876

386876

63/37 400 2% .024DIA 22AWG

Multicore
2,977 -

RFQ

386876

Ficha técnica

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.024 (0.61mm) 361°F (183°C) No-Clean 22 AWG, 23 SWG - Leaded Spool, 1 lb (454 g) - -
796037

796037

97SC C511 2% .015DIA 27AWG

Multicore
3,123 -

RFQ

796037

Ficha técnica

Bulk C511™ Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015 (0.38mm) 423°F (217°C) Rosin Mildly Activated (RMA) 27 AWG, 28 SWG - Lead Free Spool, 8.8 oz (250g) - -
450314

450314

63/37 400 2% .022DIA 23AWG

Multicore
2,048 -

RFQ

450314

Ficha técnica

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.022 (0.56mm) 361°F (183°C) No-Clean 23 AWG, 24 SWG - Leaded Spool, 1 lb (454 g) - -
796065

796065

97SC 400 2% 0.38 DIA

Multicore
2,939 -

RFQ

796065

Ficha técnica

Bulk C400 Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.015 (0.38mm) 423°F (217°C) No-Clean 27 AWG, 28 SWG - Lead Free Spool, 8.8 oz (250g) - -
865940

865940

99C C511 3C 0.81MM 0.5KG AM

Multicore
2,722 -

RFQ

865940

Ficha técnica

Bulk C511™ Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.032 (0.81mm) 440 ~ 464°F (227 ~ 240°C) No-Clean 20 AWG, 21 SWG - Lead Free Spool, 1 lb (454 g) - -
732998

732998

97SC C511 2% .064DIA 14AWG

Multicore
2,850 -

RFQ

732998

Ficha técnica

Bulk C511™ Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.064 (1.63mm) 423°F (217°C) No-Clean 14 AWG, 16 SWG - Lead Free Spool, 1 lb (454 g) - -
848874

848874

97SC C502 3C 0.81MM 0.5KG AM

Multicore
3,325 -

RFQ

848874

Ficha técnica

Bulk C502 Active Wire Solder - 0.032 (0.81mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - - Spool, 1 lb (454 g) - -
673831

673831

97SC 400 2% .048DIA 16AWG

Multicore
2,075 -

RFQ

673831

Ficha técnica

Bulk C400 Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.048 (1.22mm) 423°F (217°C) No-Clean 16 AWG, 18 SWG - Lead Free Spool, 1 lb (454 g) - -
550014

550014

63/37 WS200 SOLDER PASTE 75GM

Multicore
3,002 -

RFQ

550014

Ficha técnica

Syringe WS200™ Obsolete Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - - Leaded Syringe, 2.65 oz (75g) 6 Months Date of Manufacture
386839

386839

63/37 370 3% .032DIA 20AWG

Multicore
2,602 -

RFQ

386839

Ficha técnica

Spool 370 Obsolete Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) Rosin Activated (RA) 20 AWG, 21 SWG - Leaded Spool, 17.64 oz (500g) - -
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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