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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1051900001TOP-MOUNT CAMERA SOCKET FOR SMIA Molex |
2,898 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | 105190 | Obsolete | Camera Socket | 12 (2 x 6) | 0.033 (0.85mm) | Gold | 12.0µin (0.30µm) | Phosphor Bronze Alloy | Surface Mount | Open Frame | Solder | 0.033 (0.85mm) | Gold | Flash | Phosphor Bronze Alloy | Thermoplastic |
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1052000001SMIA55 CAMERA SOCKET BOTTOM CONT Molex |
2,587 | - |
RFQ |
Ficha técnica |
Tray | 105200 | Obsolete | Camera Socket | 12 (2 x 6) | 0.028 (0.70mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.028 (0.70mm) | Gold | Flash | Copper Alloy | Thermoplastic |
|
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1052000008SMIA55 CAMERA SOCKET BOTTOM CONT Molex |
2,242 | - |
RFQ |
Ficha técnica |
Tray | 105200 | Obsolete | Camera Socket | 12 (2 x 6) | 0.028 (0.70mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount, Through Board | Open Frame | Solder | 0.028 (0.70mm) | Gold | Flash | Copper Alloy | Thermoplastic |
|
|
0784990002CONN CAM SOCKET 24POS GOLD Molex |
3,446 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | 78499 | Obsolete | Camera Socket | 24 (2 x 4, 2 x 8) | 0.024 (0.60mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.024 (0.60mm) | Gold | Flash | Copper Alloy | Plastic |
|
|
1051990001CONN CAM SOCKET 34POS GOLD Molex |
2,507 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | 105199 | Obsolete | Camera Socket | 34 (2 x 8, 2 x 9) | 0.024 (0.60mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.024 (0.60mm) | - | - | Copper Alloy | Plastic |
|
|
510-AG92D-10CONN SOCKET SIP 10POS TIN-LEAD TE Connectivity AMP Connectors |
2,195 | - |
RFQ |
Bulk | - | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Thermoplastic | |
|
2-382712-1CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
3,453 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-382714-1CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors |
2,681 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-382719-1CONN IC DIP SOCKET 30POS TIN TE Connectivity AMP Connectors |
3,046 | - |
RFQ |
Ficha técnica |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
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1939416-1CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
3,187 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
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1939416-2CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
2,799 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
|
524-AG11DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,433 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Polyester |
|
|
814-AG11DCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,769 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
814-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,545 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
|
818-AG11D-ESLCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,420 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
|
TDU02DXTBTEST SOCKET Sullins Connector Solutions |
3,464 | - |
RFQ |
Bulk | - | Active | Axial | 2 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | |
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2174988-1CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
2,061 | - |
RFQ |
Ficha técnica |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
2040636-1CONN SOCKET LGA 1567POS GOLD TE Connectivity AMP Connectors |
3,912 | - |
RFQ |
Ficha técnica |
Tray,Box | - | Obsolete | LGA | 1567 | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic |
|
2134146-2CONN SOCKET PGA 989POS GOLD TE Connectivity AMP Connectors |
3,379 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT),Box | - | Obsolete | PGA | 989 (35 x 36) | 0.157 (4.00mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.157 (4.00mm) | Tin-Lead | Flash | Copper Alloy | Thermoplastic |
|
|
XR2C2611NCONN SOCKET SIP 26POS GOLD Omron Electronics Inc-EMC Div |
3,156 | - |
RFQ |
Ficha técnica |
Bulk | XR2 | Active | SIP | 26 (1 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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