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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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D83084B-46CONN SOCKET PLCC 84POS TIN Harwin Inc. |
3,147 | - |
RFQ |
Ficha técnica |
Tube | D830 | Obsolete | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
|
D83084C-46CONN SOCKET PLCC 84POS TIN Harwin Inc. |
3,022 | - |
RFQ |
Ficha técnica |
Tube | D830 | Obsolete | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
D95006-42CONN IC DIP SOCKET 6POS GOLD Harwin Inc. |
3,669 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
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D95016-42CONN IC DIP SOCKET 16POS GOLD Harwin Inc. |
3,280 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95018-42CONN IC DIP SOCKET 18POS GOLD Harwin Inc. |
3,391 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95032-42CONN IC DIP SOCKET 32POS GOLD Harwin Inc. |
3,114 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95A22-42CONN IC DIP SOCKET 22POS GOLD Harwin Inc. |
3,398 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95A24-42CONN IC DIP SOCKET 24POS GOLD Harwin Inc. |
3,649 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95A48-42CONN IC DIP SOCKET 48POS GOLD Harwin Inc. |
2,050 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95B24-42CONN IC DIP SOCKET 24POS GOLD Harwin Inc. |
3,304 | - |
RFQ |
Ficha técnica |
Bulk | D95 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
2676-9318-00-2401BGA SOCKET 1MM 676 POS 26X26 3M |
2,369 | - |
RFQ |
- | - | Obsolete | BGA | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
1554116-2CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors |
3,933 | - |
RFQ |
Ficha técnica |
Tray | - | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1554116-3CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors |
2,557 | - |
RFQ |
Ficha técnica |
Tray | - | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
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1939737-1CONN SOCKET LGA 1366POS TE Connectivity AMP Connectors |
2,987 | - |
RFQ |
Tray | - | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
2069965-1CONN SOCKET LGA 1155POS GOLD TE Connectivity AMP Connectors |
3,263 | - |
RFQ |
Ficha técnica |
Bulk,Bulk | - | Active | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
506-AG11DCONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
3,355 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
2,984 | - |
RFQ |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | |
|
5-1437530-2CONN IC SIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,855 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | Brass | Polyester |
|
516-AG7DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,326 | - |
RFQ |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester | |
|
524-AG11D-ESCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,062 | - |
RFQ |
Ficha técnica |
Bulk | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
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