Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-308-41-006101

116-87-308-41-006101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,062 -

RFQ

116-87-308-41-006101

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-105161

110-87-308-41-105161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,580 -

RFQ

110-87-308-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-308-41-001101

612-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,713 -

RFQ

612-87-308-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-009101

116-83-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,827 -

RFQ

116-83-304-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-29/Z-T

AW 127-29/Z-T

SOCKET 29 CONTACTS SINGLE ROW

Assmann WSW Components
3,995 -

RFQ

AW 127-29/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
612-83-306-41-001101

612-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,494 -

RFQ

612-83-306-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-10/Z-T

AW 127-10/Z-T

SOCKET 10 CONTACTS SINGLE ROW

Assmann WSW Components
2,484 -

RFQ

AW 127-10/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
122-87-306-41-001101

122-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,938 -

RFQ

122-87-306-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-306-41-001101

123-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,237 -

RFQ

123-87-306-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED020PLCZ-SM-N

ED020PLCZ-SM-N

CONN SOCKET PLCC 20POS

On Shore Technology Inc.
3,371 -

RFQ

ED020PLCZ-SM-N

Ficha técnica

Tube ED Active PLCC 20 (4 x 5) 0.050 (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS)
110-83-308-41-005101

110-83-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,146 -

RFQ

110-83-308-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-605101

110-83-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,617 -

RFQ

110-83-308-41-605101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-006101

116-83-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,645 -

RFQ

116-83-306-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-30/Z-T

AW 127-30/Z-T

SOCKET 30 CONTACTS SINGLE ROW

Assmann WSW Components
2,377 -

RFQ

AW 127-30/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
D01-9970842

D01-9970842

CONN SOCKET SIP 8POS GOLD

Harwin Inc.
3,947 -

RFQ

D01-9970842

Ficha técnica

Tube D01-997 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
115-87-312-41-001101

115-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,606 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
BU-08OZ

BU-08OZ

CONN IC DIP SOCKET 8POS

On Shore Technology Inc.
3,832 -

RFQ

Tube BU Active - 8 (2 x 4) - - - - - - - - - - - -
AW 127-31/Z-T

AW 127-31/Z-T

SOCKET 31 CONTACTS SINGLE ROW

Assmann WSW Components
3,189 -

RFQ

AW 127-31/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
110-87-314-41-005101

110-87-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,127 -

RFQ

110-87-314-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-605101

110-87-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,066 -

RFQ

110-87-314-41-605101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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