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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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517-87-685-19-000111CONN SOCKET PGA 685POS GOLD Preci-Dip |
2,869 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 685 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-91-154-13-021002SOCKET SOLDERTAIL 154-PGA Mill-Max Manufacturing Corp. |
3,036 | - |
RFQ |
Bulk | 510 | Active | PGA | 154 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-154-13-021001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,573 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 154 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-154-13-021003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,755 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 154 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
232-1291-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
3,057 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
510-91-155-16-003002SOCKET SOLDERTAIL 155-PGA Mill-Max Manufacturing Corp. |
2,018 | - |
RFQ |
Bulk | 510 | Active | PGA | 155 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-155-18-121002SOCKET SOLDERTAIL 155-PGA Mill-Max Manufacturing Corp. |
2,922 | - |
RFQ |
Bulk | 510 | Active | PGA | 155 (18 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-41-155-16-003002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,553 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 155 (16 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-169-13-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,000 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-169-13-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,342 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-169-17-101001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,709 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-169-17-101003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,521 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 169 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-155-16-003001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,476 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 155 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-155-16-003003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,818 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 155 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-155-18-121001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,660 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 155 (18 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-155-18-121003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,849 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 155 (18 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
42-3551-11CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics |
3,265 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-3552-11CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics |
3,776 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-3553-11CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics |
3,087 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-6551-11CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics |
2,104 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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