Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
124-93-640-41-002000

124-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
3,747 -

RFQ

124-93-640-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-640-41-002000

124-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,261 -

RFQ

124-43-640-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-001000

612-93-648-41-001000

SOCKET CARRIER SLDRTL .600 48POS

Mill-Max Manufacturing Corp.
2,068 -

RFQ

612-93-648-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-648-41-001000

612-43-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,554 -

RFQ

612-43-648-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-210-61-001000

115-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,790 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-210-61-001000

115-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,078 -

RFQ

Tube * Active - - - - - - - - - - - - - -
612-13-636-41-001000

612-13-636-41-001000

SOCKET CARRIER SLDRTL .600 36POS

Mill-Max Manufacturing Corp.
3,957 -

RFQ

612-13-636-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-648-41-001000

126-93-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.
3,104 -

RFQ

126-93-648-41-001000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-648-41-001000

126-43-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,934 -

RFQ

126-43-648-41-001000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-652-41-001000

121-11-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,359 -

RFQ

121-11-652-41-001000

Ficha técnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-012-05-001001

510-91-012-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,763 -

RFQ

510-91-012-05-001001

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-012-05-001002

510-91-012-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,703 -

RFQ

510-91-012-05-001002

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-012-05-001003

510-91-012-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,227 -

RFQ

510-91-012-05-001003

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-310-61-001000

110-13-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,028 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-44-306-61-003000

115-44-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,457 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-43-210-61-001000

111-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,202 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-210-61-001000

111-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,637 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-952-41-007000

116-93-952-41-007000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,581 -

RFQ

116-93-952-41-007000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-007000

116-43-952-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,993 -

RFQ

116-43-952-41-007000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-652-41-780000

104-13-652-41-780000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,996 -

RFQ

104-13-652-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
Total 12145 Record«Prev1... 228229230231232233234235...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario