Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
605-41-950-11-480000

605-41-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,654 -

RFQ

605-41-950-11-480000

Ficha técnica

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-950-11-480000

605-91-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,058 -

RFQ

605-91-950-11-480000

Ficha técnica

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-650-41-780000

104-11-650-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,329 -

RFQ

104-11-650-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-652-41-001000

614-41-652-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,471 -

RFQ

614-41-652-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-41-001000

614-91-652-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,370 -

RFQ

614-91-652-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-648-31-007000

614-93-648-31-007000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.
3,436 -

RFQ

614-93-648-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-648-31-007000

614-43-648-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,068 -

RFQ

614-43-648-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-636-41-002000

126-41-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,035 -

RFQ

126-41-636-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-636-41-002000

126-91-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,968 -

RFQ

126-91-636-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-640-41-001000

116-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,737 -

RFQ

116-93-640-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-640-41-001000

116-43-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,780 -

RFQ

116-43-640-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-964-41-001000

111-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
2,110 -

RFQ

111-93-964-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-964-41-001000

111-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,478 -

RFQ

111-43-964-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-432-41-003000

126-41-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,063 -

RFQ

126-41-432-41-003000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-632-41-003000

126-41-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,880 -

RFQ

126-41-632-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-432-41-003000

126-91-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,212 -

RFQ

126-91-432-41-003000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-632-41-003000

126-91-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,420 -

RFQ

126-91-632-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-650-31-002000

614-41-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,462 -

RFQ

614-41-650-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-650-31-002000

614-91-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,053 -

RFQ

614-91-650-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-952-31-018000

614-41-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,229 -

RFQ

614-41-952-31-018000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 212213214215216217218219...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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