Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-13-320-41-801000

123-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,931 -

RFQ

123-13-320-41-801000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-950-41-007000

116-47-950-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,238 -

RFQ

116-47-950-41-007000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
415-93-272-41-003000

415-93-272-41-003000

SOCKET DUAL INLINE LOW PRO 72POS

Mill-Max Manufacturing Corp.
3,886 -

RFQ

415-93-272-41-003000

Ficha técnica

Tube 415 Active DIP, 0.1 (2.54mm) Row Spacing 72 (2 x 36) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-642-41-001000

121-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,928 -

RFQ

121-11-642-41-001000

Ficha técnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-650-31-007000

614-41-650-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,486 -

RFQ

614-41-650-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-650-31-007000

614-91-650-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,649 -

RFQ

614-91-650-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-652-41-105000

117-41-652-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,784 -

RFQ

117-41-652-41-105000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-648-41-780000

104-11-648-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,973 -

RFQ

104-11-648-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-328-41-801000

123-93-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,938 -

RFQ

123-93-328-41-801000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
217-93-764-41-005000

217-93-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
2,397 -

RFQ

217-93-764-41-005000

Ficha técnica

Tube 217 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
217-43-764-41-005000

217-43-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,458 -

RFQ

217-43-764-41-005000

Ficha técnica

Tube 217 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-650-41-001000

614-41-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,100 -

RFQ

614-41-650-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-650-41-001000

614-91-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,127 -

RFQ

614-91-650-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-652-31-012000

614-41-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,292 -

RFQ

614-41-652-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-31-012000

614-91-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,455 -

RFQ

614-91-652-31-012000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-642-41-780000

104-13-642-41-780000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,400 -

RFQ

104-13-642-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
614-41-648-31-002000

614-41-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,980 -

RFQ

614-41-648-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-648-31-002000

614-91-648-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,990 -

RFQ

614-91-648-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-964-41-001000

115-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
3,010 -

RFQ

115-93-964-41-001000

Ficha técnica

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-964-41-001000

115-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,080 -

RFQ

115-43-964-41-001000

Ficha técnica

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 207208209210211212213214...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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