Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
127-91-428-41-002000

127-91-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,798 -

RFQ

127-91-428-41-002000

Ficha técnica

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-628-41-002000

127-91-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,674 -

RFQ

127-91-628-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-322-41-001000

121-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,976 -

RFQ

121-13-322-41-001000

Ficha técnica

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-422-41-001000

121-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,860 -

RFQ

121-13-422-41-001000

Ficha técnica

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-260-31-018000

714-43-260-31-018000

CONN IC DIP SOCKET 60POS GOLD

Mill-Max Manufacturing Corp.
2,370 -

RFQ

714-43-260-31-018000

Ficha técnica

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-428-31-012000

614-93-428-31-012000

SOCKET CARRIER LOWPRO .400 28POS

Mill-Max Manufacturing Corp.
2,270 -

RFQ

614-93-428-31-012000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-31-012000

614-43-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,239 -

RFQ

614-43-428-31-012000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-328-41-004000

612-43-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,385 -

RFQ

612-43-328-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-428-41-004000

612-43-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,210 -

RFQ

612-43-428-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-628-41-004000

612-43-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,893 -

RFQ

612-43-628-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-328-41-004000

612-93-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,835 -

RFQ

612-93-328-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-428-41-004000

612-93-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,498 -

RFQ

612-93-428-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-628-41-004000

612-93-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,986 -

RFQ

612-93-628-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-31-002000

614-41-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,435 -

RFQ

614-41-642-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-31-002000

614-91-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,215 -

RFQ

614-91-642-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-318-41-004000

612-43-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,770 -

RFQ

612-43-318-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-318-41-004000

612-93-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,206 -

RFQ

612-93-318-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-640-11-480000

605-93-640-11-480000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,978 -

RFQ

605-93-640-11-480000

Ficha técnica

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-640-11-480000

605-43-640-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,734 -

RFQ

605-43-640-11-480000

Ficha técnica

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-320-41-002000

126-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,815 -

RFQ

126-93-320-41-002000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 174175176177178179180181...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario