Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-43-316-10-003000

110-43-316-10-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
757 -

RFQ

110-43-316-10-003000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-43-104-41-005000

917-43-104-41-005000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.
728 -

RFQ

917-43-104-41-005000

Ficha técnica

Tube 917 Active Transistor, TO-5 4 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-108-41-005000

317-47-108-41-005000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.
128 -

RFQ

317-47-108-41-005000

Ficha técnica

Tube 317 Active SIP 8 (1 x 8) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-424-41-001000

110-99-424-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.
252 -

RFQ

110-99-424-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-318-41-003000

115-47-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
194 -

RFQ

115-47-318-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-314-01-670800

214-99-314-01-670800

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.
195 -

RFQ

214-99-314-01-670800

Ficha técnica

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-628-41-001000

210-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
121 -

RFQ

210-47-628-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-210-10-001000

110-43-210-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,051 -

RFQ

110-43-210-10-001000

Ficha técnica

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-318-01-670800

214-99-318-01-670800

CONN IC DIP SOCKET 18POS TINLEAD

Mill-Max Manufacturing Corp.
417 -

RFQ

214-99-318-01-670800

Ficha técnica

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-422-41-001000

110-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
267 -

RFQ

110-43-422-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-640-41-001000

110-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.
593 -

RFQ

110-99-640-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-308-41-001000

123-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
765 -

RFQ

123-93-308-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-324-41-001000

110-43-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
655 -

RFQ

110-43-324-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-624-41-001000

110-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
112 -

RFQ

110-43-624-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-624-41-001000

110-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
591 -

RFQ

110-93-624-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-324-41-001000

110-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
243 -

RFQ

110-93-324-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-640-41-001000

110-47-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
178 -

RFQ

110-47-640-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-43-108-41-005000

917-43-108-41-005000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.
651 -

RFQ

917-43-108-41-005000

Ficha técnica

Tube 917 Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-93-108-41-005000

917-93-108-41-005000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.
746 -

RFQ

917-93-108-41-005000

Ficha técnica

Tube 917 Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-308-41-001000

123-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,010 -

RFQ

123-43-308-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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