Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-13-428-41-001000

123-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,560 -

RFQ

123-13-428-41-001000

Ficha técnica

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-648-31-018000

614-93-648-31-018000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.
3,010 -

RFQ

614-93-648-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-0501-21

24-0501-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics
2,368 -

RFQ

24-0501-21

Ficha técnica

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-31

24-0501-31

CONN SOCKET SIP 24POS GOLD

Aries Electronics
2,811 -

RFQ

24-0501-31

Ficha técnica

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
326-93-132-41-002000

326-93-132-41-002000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.
2,952 -

RFQ

326-93-132-41-002000

Ficha técnica

Tube 326 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-642-41-004000

612-41-642-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,325 -

RFQ

612-41-642-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-648-41-008000

116-43-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,768 -

RFQ

116-43-648-41-008000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-9503-20

32-9503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,867 -

RFQ

32-9503-20

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-9503-30

32-9503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,029 -

RFQ

32-9503-30

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-20

24-4508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,545 -

RFQ

24-4508-20

Ficha técnica

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-91-964-41-006000

116-91-964-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,638 -

RFQ

116-91-964-41-006000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
13-0511-11

13-0511-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics
3,555 -

RFQ

13-0511-11

Ficha técnica

Bulk 511 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-6621-30

20-6621-30

CONN IC DIP SOCKET 20POS TIN

Aries Electronics
2,861 -

RFQ

20-6621-30

Ficha técnica

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
127-93-642-41-002000

127-93-642-41-002000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
3,641 -

RFQ

127-93-642-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-642-41-002000

127-43-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,622 -

RFQ

127-43-642-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-652-41-008000

116-41-652-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,187 -

RFQ

116-41-652-41-008000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-652-41-008000

116-91-652-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,069 -

RFQ

116-91-652-41-008000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-650-11-480000

605-41-650-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,785 -

RFQ

605-41-650-11-480000

Ficha técnica

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-650-11-480000

605-91-650-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,716 -

RFQ

605-91-650-11-480000

Ficha técnica

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0501-21

25-0501-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics
3,227 -

RFQ

25-0501-21

Ficha técnica

Bulk 501 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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Daily average RFQ Volume
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Standard Product Unit
20,000.000 Unidad estándar de producto
Worldwide Manufacturers
1800+ Fabricantes en todo el mundo
In-stock Warehouse
15,000+ Almacén en inventario
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