Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-93-624-41-003000

612-93-624-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,101 -

RFQ

612-93-624-41-003000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-432-41-002000

126-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,058 -

RFQ

126-41-432-41-002000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-632-41-002000

126-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,986 -

RFQ

126-41-632-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-628-41-002000

124-93-628-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,756 -

RFQ

124-93-628-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-328-41-002000

124-43-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,822 -

RFQ

124-43-328-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-428-41-002000

124-43-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,841 -

RFQ

124-43-428-41-002000

Ficha técnica

Tube 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-628-41-002000

124-43-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,739 -

RFQ

124-43-628-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-624-41-001000

121-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,171 -

RFQ

121-13-624-41-001000

Ficha técnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-640-61-001000

110-41-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,638 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-640-61-001000

110-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,680 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-44-640-61-001000

110-44-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,483 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-640-61-001000

110-93-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,377 -

RFQ

Tube * Active - - - - - - - - - - - - - -
85-PGM11007-10

85-PGM11007-10

CONN SOCKET PGA GOLD

Aries Electronics
3,436 -

RFQ

85-PGM11007-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
104-13-328-41-770000

104-13-328-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,050 -

RFQ

104-13-328-41-770000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-428-41-770000

104-13-428-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,940 -

RFQ

104-13-428-41-770000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-628-41-770000

104-13-628-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,549 -

RFQ

104-13-628-41-770000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
64-9518-10M

64-9518-10M

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
3,927 -

RFQ

64-9518-10M

Ficha técnica

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-13-316-41-801000

122-13-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,988 -

RFQ

122-13-316-41-801000

Ficha técnica

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-432-41-003000

612-43-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,160 -

RFQ

612-43-432-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-632-41-003000

612-43-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,837 -

RFQ

612-43-632-41-003000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 479480481482483484485486...1100Next»
Daily average RFQ Volume
1500+ Promedio diario de RFQ
Standard Product Unit
20,000.000 Unidad estándar de producto
Worldwide Manufacturers
1800+ Fabricantes en todo el mundo
In-stock Warehouse
15,000+ Almacén en inventario
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