Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-93-632-41-013000

146-93-632-41-013000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,914 -

RFQ

146-93-632-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-632-41-013000

146-43-632-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,752 -

RFQ

146-43-632-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-328-41-001000

614-41-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,021 -

RFQ

614-41-328-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-428-41-001000

614-41-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,850 -

RFQ

614-41-428-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-628-41-001000

614-41-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,186 -

RFQ

614-41-628-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-328-41-001000

614-91-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,380 -

RFQ

614-91-328-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-428-41-001000

614-91-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,341 -

RFQ

614-91-428-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-628-41-001000

614-91-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,565 -

RFQ

614-91-628-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-314-41-801000

122-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,803 -

RFQ

122-13-314-41-801000

Ficha técnica

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-162-31-018000

714-43-162-31-018000

CONN SOCKET SIP 62POS GOLD

Mill-Max Manufacturing Corp.
2,318 -

RFQ

714-43-162-31-018000

Ficha técnica

Bulk 714 Active SIP 62 (1 x 62) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-636-31-018000

614-93-636-31-018000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,184 -

RFQ

614-93-636-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-636-31-018000

614-43-636-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,966 -

RFQ

614-43-636-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
88-PGM13041-10

88-PGM13041-10

CONN SOCKET PGA GOLD

Aries Electronics
3,275 -

RFQ

88-PGM13041-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
124-93-316-41-002000

124-93-316-41-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,479 -

RFQ

124-93-316-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-316-41-002000

124-43-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,570 -

RFQ

124-43-316-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-322-41-004000

612-41-322-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,413 -

RFQ

612-41-322-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-422-41-004000

612-41-422-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,356 -

RFQ

612-41-422-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-322-41-004000

612-91-322-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,541 -

RFQ

612-91-322-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-422-41-004000

612-91-422-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,637 -

RFQ

612-91-422-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-950-41-006000

116-41-950-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,561 -

RFQ

116-41-950-41-006000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 453454455456457458459460...1100Next»
Daily average RFQ Volume
1500+ Promedio diario de RFQ
Standard Product Unit
20,000.000 Unidad estándar de producto
Worldwide Manufacturers
1800+ Fabricantes en todo el mundo
In-stock Warehouse
15,000+ Almacén en inventario
FudongIC

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