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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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257-PGM20012-10CONN SOCKET PGA GOLD Aries Electronics |
2,581 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Obsolete | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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1109800-14CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,645 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109800-16CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,485 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109800-18CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,490 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109800-20CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,993 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109800-28CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,496 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109800-10CONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,502 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109800-12CONN IC DIP SOCKET 12POS GOLD Aries Electronics |
3,023 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109800-22CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,606 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109800-24CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,964 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109800-26CONN IC DIP SOCKET 26POS GOLD Aries Electronics |
2,002 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
1109800-8CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,116 | - |
RFQ |
Ficha técnica |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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1109681-308CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,577 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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1109681-314CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,534 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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1109681-316CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,938 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109681-318CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,089 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109681-320CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,632 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109681-324CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,893 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109681-328CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,569 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109681-624CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,168 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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