Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-7XXXX-10

36-7XXXX-10

CONN SOCKET SIP 36POS TIN

Aries Electronics
3,759 -

RFQ

36-7XXXX-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-7XXXX-10

37-7XXXX-10

CONN SOCKET SIP 37POS TIN

Aries Electronics
3,696 -

RFQ

37-7XXXX-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-7XXXX-10

38-7XXXX-10

CONN SOCKET SIP 38POS TIN

Aries Electronics
3,204 -

RFQ

38-7XXXX-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 38 (1 x 38) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-7XXXX-10

39-7XXXX-10

CONN SOCKET SIP 39POS TIN

Aries Electronics
2,930 -

RFQ

39-7XXXX-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-7XXXX-10

40-7XXXX-10

CONN SOCKET SIP 40POS TIN

Aries Electronics
3,041 -

RFQ

40-7XXXX-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-513-10T

16-513-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics
2,413 -

RFQ

16-513-10T

Ficha técnica

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109011

1109011

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics
2,942 -

RFQ

1109011

Ficha técnica

- - Active - - - - - - - - - - - - - -
1109294

1109294

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics
3,472 -

RFQ

1109294

Ficha técnica

- - Active - - - - - - - - - - - - - -
08-6513-11H

08-6513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,532 -

RFQ

08-6513-11H

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108831

1108831

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics
2,243 -

RFQ

1108831

Ficha técnica

- - Active - - - - - - - - - - - - - -
4236-118-14

4236-118-14

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics
3,621 -

RFQ

4236-118-14

Ficha técnica

- - Active - - - - - - - - - - - - - -
1107425

1107425

508 OPN FRM COLLET SCKT WIRE WRP

Aries Electronics
3,378 -

RFQ

- - Active - - - - - - - - - - - - - -
1108594

1108594

508 OPN FRM COLLET SCKT WIRE WRP

Aries Electronics
2,024 -

RFQ

1108594

Ficha técnica

- - Active - - - - - - - - - - - - - -
29-0508-20

29-0508-20

X508 SMD SNG/DUAL SCKT WIRE WRAP

Aries Electronics
3,987 -

RFQ

29-0508-20

Ficha técnica

- 505 Active - - - - - - - - - - - - - -
2357-108-12

2357-108-12

EJECT-A-DP LCK/EJCT SCKT SLDR TL

Aries Electronics
3,862 -

RFQ

2357-108-12

Ficha técnica

- - Active - - - - - - - - - - - - - -
5679-107-12

5679-107-12

518 OPN FRM CAP SOCKET SLDR TAIL

Aries Electronics
2,942 -

RFQ

5679-107-12

Ficha técnica

- - Active - - - - - - - - - - - - - -
7340-140-12

7340-140-12

518 OPN FRM CAP SOCKET SLDR TAIL

Aries Electronics
3,264 -

RFQ

7340-140-12

Ficha técnica

- - Active - - - - - - - - - - - - - -
40-6518-101T

40-6518-101T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,497 -

RFQ

40-6518-101T

Ficha técnica

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108252

1108252

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,692 -

RFQ

1108252

Ficha técnica

- - Active - - - - - - - - - - - - - -
1109124

1109124

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,969 -

RFQ

1109124

Ficha técnica

- - Active - - - - - - - - - - - - - -
Total 4324 Record«Prev1... 207208209210211212213214...217Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario