Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
C8122-04

C8122-04

CONN IC DIP SOCKET 22POS TIN

Aries Electronics
2,386 -

RFQ

C8122-04

Ficha técnica

Bulk Edge-Grip™, C81 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8124-04

C8124-04

CONN IC DIP SOCKET 24POS TIN

Aries Electronics
2,285 -

RFQ

C8124-04

Ficha técnica

Bulk Edge-Grip™, C81 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8128-04

C8128-04

CONN IC DIP SOCKET 28POS TIN

Aries Electronics
2,267 -

RFQ

C8128-04

Ficha técnica

Bulk Edge-Grip™, C81 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8140-04

C8140-04

CONN IC DIP SOCKET 40POS TIN

Aries Electronics
2,480 -

RFQ

C8140-04

Ficha técnica

Bulk Edge-Grip™, C81 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9108-00

C9108-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,597 -

RFQ

C9108-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9114-00

C9114-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,546 -

RFQ

C9114-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9116-00

C9116-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,939 -

RFQ

C9116-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9118-00

C9118-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,056 -

RFQ

C9118-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9120-00

C9120-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,464 -

RFQ

C9120-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9122-00

C9122-00

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,150 -

RFQ

C9122-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9124-00

C9124-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,361 -

RFQ

C9124-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9128-00

C9128-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,352 -

RFQ

C9128-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C9140-00

C9140-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,678 -

RFQ

C9140-00

Ficha técnica

Bulk Edge-Grip™, C91 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-516-10

40-516-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,332 -

RFQ

40-516-10

Ficha técnica

Bulk 516 Obsolete DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
24-516-10

24-516-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,629 -

RFQ

24-516-10

Ficha técnica

Bulk 516 Obsolete DIP, ZIF (ZIP) 24 (2 x 12) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
28-516-10

28-516-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
3,767 -

RFQ

28-516-10

Ficha técnica

Bulk 516 Obsolete DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
28-536-11

28-536-11

CONN SOCKET PLCC ZIF 28POS GOLD

Aries Electronics
3,123 -

RFQ

- 536 Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
44-536-11

44-536-11

CONN SOCKET PLCC ZIF 44POS GOLD

Aries Electronics
2,361 -

RFQ

- 536 Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
68-536-11

68-536-11

CONN SOCKET PLCC ZIF 68POS GOLD

Aries Electronics
2,434 -

RFQ

- 536 Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
84-536-11

84-536-11

CONN SOCKET PLCC ZIF 84POS GOLD

Aries Electronics
3,086 -

RFQ

- 536 Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
Total 4324 Record«Prev1... 200201202203204205206207...217Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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