Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-3553-16

40-3553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics
3,027 -

RFQ

40-3553-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-16

40-6551-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics
2,905 -

RFQ

40-6551-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-16

40-6552-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics
3,442 -

RFQ

40-6552-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-16

40-6553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics
2,496 -

RFQ

40-6553-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3554-16

40-3554-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics
2,155 -

RFQ

40-3554-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
64-9508-21

64-9508-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
3,285 -

RFQ

64-9508-21

Ficha técnica

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9508-31

64-9508-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
3,963 -

RFQ

64-9508-31

Ficha técnica

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-PRS15068-12

15-PRS15068-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,241 -

RFQ

15-PRS15068-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
18-PLS15071-12

18-PLS15071-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,521 -

RFQ

18-PLS15071-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
18-PRS15071-12

18-PRS15071-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,879 -

RFQ

18-PRS15071-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
163-PGM15066-10T

163-PGM15066-10T

CONN SOCKET PGA TIN

Aries Electronics
3,833 -

RFQ

163-PGM15066-10T

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
163-PGM15067-10T

163-PGM15067-10T

CONN SOCKET PGA TIN

Aries Electronics
2,528 -

RFQ

163-PGM15067-10T

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
65-PRS10008-12

65-PRS10008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,435 -

RFQ

65-PRS10008-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
65-PRS11037-12

65-PRS11037-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,706 -

RFQ

65-PRS11037-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
66-PLS11049-12

66-PLS11049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,226 -

RFQ

66-PLS11049-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PGM15001-51

225-PGM15001-51

CONN SOCKET PGA GOLD

Aries Electronics
2,010 -

RFQ

225-PGM15001-51

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
66-PRS11054-12

66-PRS11054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,374 -

RFQ

66-PRS11054-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
66-PLS11054-12

66-PLS11054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,841 -

RFQ

66-PLS11054-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PRS11033-12

68-PRS11033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,884 -

RFQ

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PLS11033-12

68-PLS11033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,177 -

RFQ

68-PLS11033-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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1500+
1500+ Promedio diario de RFQ
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1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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