Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
224-5248-00-0602J

224-5248-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M
3,450 -

RFQ

224-5248-00-0602J

Ficha técnica

Bulk Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
110-87-640-41-001151

110-87-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
141 -

RFQ

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
A-CCS 052-G-T

A-CCS 052-G-T

CONN SOCKET PLCC 52POS GOLD

Assmann WSW Components
1,099 -

RFQ

A-CCS 052-G-T

Ficha técnica

Tube - Active PLCC 52 (4 x 13) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT)
28-6518-10

28-6518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
919 -

RFQ

28-6518-10

Ficha técnica

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
228-1371-00-0602J

228-1371-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M
2,473 -

RFQ

228-1371-00-0602J

Ficha técnica

Tray Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-3639-00-0602J

240-3639-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M
3,997 -

RFQ

240-3639-00-0602J

Ficha técnica

Bulk Textool™ Active DIP, ZIF (ZIP), 1.0 (25.40mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
220-7201-55-1902

220-7201-55-1902

CONN SOCKET SOIC 20POS GOLD

3M
2,373 -

RFQ

220-7201-55-1902

Ficha técnica

Bulk Textool™ Active SOIC 20 (2 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
264-4493-00-0602J

264-4493-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M
3,098 -

RFQ

264-4493-00-0602J

Ficha técnica

Tube Textool™ Active DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
248-5205-00

248-5205-00

CONN SOCKET QFN 48POS GOLD

3M
3,343 -

RFQ

248-5205-00

Ficha técnica

Bulk Textool™ Active QFN 48 (4 x 12) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
224-5205-01

224-5205-01

CONN SOCKET QFN 24POS GOLD

3M
3,435 -

RFQ

224-5205-01

Ficha técnica

Bulk Textool™ Active QFN 24 (4x4) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
228-5204-01

228-5204-01

CONN SOCKET QFN 28POS GOLD

3M
2,190 -

RFQ

228-5204-01

Ficha técnica

Bulk Textool™ Active QFN 28 (4 x 7) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
248-5205-01

248-5205-01

CONN SOCKET QFN 48POS GOLD

3M
2,558 -

RFQ

248-5205-01

Ficha técnica

Bulk Textool™ Active QFN 48 (4 x 12) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
264-5205-01

264-5205-01

CONN SOCKET QFN 64POS GOLD

3M
2,095 -

RFQ

264-5205-01

Ficha técnica

Bulk Textool™ Active QFN 64 (4 x 16) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
84-537-21

84-537-21

CONN SOCKET PLCC ZIF 84POS GOLD

Aries Electronics
3,485 -

RFQ

84-537-21

Ficha técnica

- 537 Active PLCC, ZIF (ZIP) 84 (4 x 21) 0.100 (2.54mm) Gold 12.0µin (0.30µm) - Surface Mount Closed Frame - - - - - -
224-5809-00-0602

224-5809-00-0602

CONN SOCKET SIP ZIF 24POS GOLD

3M
3,527 -

RFQ

224-5809-00-0602

Ficha técnica

Bulk Textool™ Active SIP, ZIF (ZIP) 24 (1 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
A 32-LC-TR

A 32-LC-TR

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components
551 -

RFQ

A 32-LC-TR

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
EDO-32PLCZSM

EDO-32PLCZSM

CONN SOCKET PLCC 32POS

On Shore Technology Inc.
518 -

RFQ

EDO-32PLCZSM

Ficha técnica

Tube ED Active PLCC 32 (2 x 16) 0.050 (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS)
111-47-306-41-001000

111-47-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
126 -

RFQ

111-47-306-41-001000

Ficha técnica

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-308-41-001000

111-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
896 -

RFQ

111-47-308-41-001000

Ficha técnica

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-308-01-670800

214-99-308-01-670800

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.
493 -

RFQ

214-99-308-01-670800

Ficha técnica

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 3233343536373839...1100Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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